[VLP] Iprofayile ephantsi kakhulu ye-ED Copper Foil
![[VLP] Iprofayile ephantsi kakhulu ye-ED Copper Foil Featured Featured Image](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Intshayelelo yeMveliso
I-VLP, iprofayili yobhedu ye-electrolytic ephantsi kakhulu eveliswe yi-CIVEN METAL ineempawu zoburhabaxa obuphantsi kunye namandla aphezulu e-peel.I-foil yobhedu eveliswe yinkqubo ye-electrolysis ineenzuzo zokucoceka okuphezulu, ukungcola okuphantsi, indawo egudileyo, imilo yebhodi ecaba, kunye nobubanzi obukhulu.I-copper ye-electrolytic foil inokuba ngcono i-laminated kunye nezinye izinto emva kokuba i-roughening kwelinye icala, kwaye akulula ukuyikhupha.
Iinkcukacha
I-CIVEN inokubonelela nge-ultra-low profile yobushushu obuphezulu be-ductile electrolytic copper foil (VLP) ukusuka kwi-1/4oz ukuya kwi-3oz (ubukhulu begama obuyi-9µm ukuya kwi-105µm), kunye nobukhulu besayizi yemveliso yi-1295mm x 1295mm yephepha lephepha lobhedu.
Ukusebenza
CIVEN ibonelela ngefoyile yobhedu etyebileyo ye-electrolytic eneempawu ezibalaseleyo zomzimba ze-equiaxial fine crystal, iprofayile ephantsi, amandla aphezulu kunye nobude obuphezulu.(Jonga kwiTheyibhile 1)
Usetyenziso
Isebenza ekwenziweni kweebhodi zesekethe zamandla aphezulu kunye neebhodi ze-high-frequency zemoto, amandla ombane, unxibelelwano, umkhosi kunye ne-aerospace.
Iimpawu
Ukuthelekisa kunye neemveliso ezifanayo zangaphandle.
1.Isakhiwo senkozo ye-VLP yethu ye-electrolytic foil yobhedu i-equiaxed crystal spherical spherical;ngelixa ulwakhiwo lweenkozo zeemveliso ezifanayo zangaphandle luyikholomu kwaye lude.
2. Ifoyile yobhedu ye-Electrolytic yiprofayili ye-ultra-low, i-3oz ye-copper foil gross surface Rz ≤ 3.5µm;ngelixa iimveliso ezifanayo zangaphandle ziyiprofayili eqhelekileyo, i-3oz yefoyile yobhedu igross surface Rz > 3.5µm.
Iingenelo
1.Njengoko imveliso yethu ikwiprofayili esezantsi kakhulu, isombulula umngcipheko onokubakho womgca wesekethe emfutshane ngenxa yoburhabaxa obukhulu befoyile yobhedu eshinyeneyo eqhelekileyo kunye nokungena lula kwephepha elibhityileyo lokufakelwa yi "ingcuka yezinyo" xa ucinezela iphaneli enamacala amabini.
2.Ngenxa yokuba ukwakhiwa kweenkozo zeemveliso zethu ku-equiaxed i-crystal spherical, inciphisa ixesha lokulinganisa umgca kwaye iphucula ingxaki yomgca wecala elingalinganiyo.
I-3, ngelixa unamandla aphezulu e-peel, akukho ukuhanjiswa komgubo wobhedu, i-graphics ecacileyo ye-PCB yokuvelisa ukusebenza.
Ukusebenza(GB/T5230-2000、IPC-4562-2000)
| Ukuhlelwa | Iyunithi | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu Umxholo | % | ≥99.8 | ||||||
| Ubunzima beNdawo | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Tensile strength | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | |||||
| Elongation | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180℃) | ≥6.0 | ≥8.0 | ||||||
| Uburhabaxa | Shiny(Ra) | μm | ≤0.43 | |||||
| IMatte(Rz) | ≤3.5 | |||||||
| Amandla e-Peel | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Izinga elithotyiweyo leHCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
| Ukutshintsha kombala(E-1.0hr/200℃) | % | Kulungile | ||||||
| ISolder edadayo 290℃ | Isiqendu. | ≥20 | ||||||
| Imbonakalo (Ibala kunye nomgubo wobhedu) | ---- | Akukho nanye | ||||||
| Umngxuma wokuqhafaza | EA | Unothi | ||||||
| Ukunyamezelwa kobungakanani | Ububanzi | mm | 0 ~ 2mm | |||||
| Ubude | mm | ---- | ||||||
| Undoqo | Mm/intshi | Ngaphakathi Ububanzi 79mm/3 intshi | ||||||
Phawula:1. Ixabiso le-Rz lefoyile yobhedu lixabiso elizinzileyo lovavanyo, hayi ixabiso eliqinisekisiweyo.
2. Amandla e-Peel yixabiso eliqhelekileyo lokuvavanya ibhodi ye-FR-4 (amaphepha ama-5 e-7628PP).
3. Ixesha lokuqinisekiswa komgangatho ziintsuku ezingama-90 ukususela kumhla wokufunyanwa kwayo.
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