I-HTE Electrodeposited Copper Foils ye-PCB

Inkcazelo emfutshane:

I-copper ye-electrolytic foil eveliswa yi-CIVEN METAL inokumelana kakuhle nokushisa okuphezulu kunye ne-ductility ephezulu.I-foil yobhedu ayifaki i-oxidize okanye itshintshe umbala kumaqondo aphezulu, kwaye i-ductility yayo enhle yenza kube lula ukulahla kunye nezinye izinto.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Intshayelelo yeMveliso

I-copper ye-electrolytic foil eveliswa yi-CIVEN METAL inokumelana kakuhle nokushisa okuphezulu kunye ne-ductility ephezulu.I-foil yobhedu ayifaki i-oxidize okanye itshintshe umbala kumaqondo aphezulu, kwaye i-ductility yayo enhle yenza kube lula ukulahla kunye nezinye izinto.I-foil yobhedu eveliswa yinkqubo ye-electrolysis inomgangatho ococekileyo kakhulu kunye ne-flat sheet shape.I-foil yobhedu ngokwayo igxininiswe kwicala elinye, okwenza kube lula ukunamathela kwezinye izinto.Ukucoceka ngokubanzi kwefoyile yobhedu kuphezulu kakhulu, kwaye inombane obalaseleyo kunye nokuhanjiswa kwe-thermal.Ukuze sihlangabezane neemfuno zabathengi bethu, asikwazi ukubonelela kuphela ngee-rolls ze-foil yobhedu, kodwa kunye neenkonzo zokuqhawula ngokwezifiso.

Iinkcukacha

Ukutyeba: 1/4OZ~20OZ(9µm~70µm)

Ububanzi: 550mm ~ 1295mm

Ukusebenza

Imveliso inentsebenzo yokugcina ubushushu begumbi, ubushushu obuphezulu bokusebenza kokumelana ne-oxidation, umgangatho wemveliso ukuhlangabezana nomgangatho we-IPC-4562 Ⅱ, Ⅲ iimfuno zenqanaba.

Usetyenziso

Ilungele zonke iintlobo zenkqubo yeresin enamacala amabini, ibhodi yesekethe eprintiweyo kaninzi.

Iingenelo

Imveliso ithatha inkqubo ekhethekileyo yonyango yokuphucula umgangatho wemveliso ukuchasana nokugqwala okuphantsi kunye nokunciphisa umngcipheko wentsalela yobhedu.

Ukusebenza(GB/T5230-2000、IPC-4562-2000)

Ukuhlelwa

Iyunithi

1/4OZ

(9μm)

1/3OZ

(12μm)

J OZ

(15μm)

1/2OZ

(18μm)

1OZ

(35μm)

2OZ

(70μm)

Cu Umxholo

%

≥99.8

Ubunzima beNdawo

g/m2

80±3

107±3

127±4

153±5

283±5

585±10

Tensile strength

RT(25℃)

Kg/mm2

≥28

≥30

HT(180℃)

≥15

Ukwandisa

RT(25℃)

%

≥4.0

≥5.0

≥6.0

≥10

HT(180℃)

≥4.0

≥5.0

≥6.0

Uburhabaxa

Shiny(Ra)

μm

≤0.4

IMatte(Rz)

≤5.0

≤6.0

≤7.0

≤7.0

≤9.0

≤14

Amandla e-Peel

RT(23℃)

Kg/cm

≥1.0

≥1.2

≥1.2

≥1.3

≥1.8

≥2.0

Izinga elithotyiweyo leHCΦ(18%-1hr/25℃)

%

≤5.0

Ukutshintsha kombala(E-1.0hr/190℃)

%

Kulungile

ISolder edadayo 290℃

Isiqendu.

≥20

Umngxuma wokuqhafaza

EA

Unothi

Preperg

----

FR-4

Phawula:1. Ixabiso le-Rz le-copper foil gross surface lixabiso elizinzileyo lovavanyo, hayi ixabiso eliqinisekisiweyo.

2. Amandla e-Peel yixabiso eliqhelekileyo lokuvavanya ibhodi ye-FR-4 (amaphepha ama-5 e-7628PP).

3. Ixesha lokuqinisekiswa komgangatho ziintsuku ezingama-90 ukususela kumhla wokufunyanwa kwayo.


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  • Okulandelayo:

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