[RTF] Reverse Treated ED Copper Foil
Intshayelelo yeMveliso
I-RTF, ifoyile yobhedu ephathwayo ye-electrolytic yifoyile yobhedu eye yarhabaxa ukuya kumaqondo ahlukeneyo macala omabini.Oku komeleza amandla e-peel kumacala omabini efoyile yobhedu, okwenza kube lula ukuyisebenzisa njengomaleko ophakathi wokudibanisa kwezinye izinto.Ngaphezu koko, amanqanaba ahlukeneyo onyango kumacala omabini e-foil yobhedu enza kube lula ukubeka icala elincinci le-roughened layer.Kwinkqubo yokwenza ibhodi yesekethe eprintiweyo (PCB) iphaneli, icala eliphathwayo lobhedu lisetyenziswe kwizinto ze-dielectric.Icala legubu eliphathwayo lirhabaxa kunelinye icala, elenza ukuncamathela okukhulu kwidielectric.Le yeyona nzuzo iphambili ngaphezu kobhedu oluqhelekileyo lwe-electrolytic.Icala le-matte alifuni naluphi na unyango lomatshini okanye lwekhemikhali ngaphambi kokusetyenziswa kwe-photoresist.Sele rhabaxa ngokwaneleyo ukuba laminating elungileyo ukumelana adhesion.
Iinkcukacha
I-CIVEN inokubonelela nge-RTF yefoyile yobhedu ye-electrolytic enobunzima obuyi-12 ukuya kwi-35µm ukuya kuthi ga kwi-1295mm ububanzi.
Ukusebenza
Ubude beqondo lobushushu obuphakamileyo obubuyiselwe umva ifoyile yobhedu ye-electrolytic ephathwayo iphantsi kwenkqubo echanekileyo yokucwenga ukulawula ubungakanani bamathumba obhedu kwaye uwasasaze ngokulinganayo.Umphezulu otshintshiweyo okhanyayo wefoyile yobhedu unokunciphisa kakhulu uburhabaxa befoyile yobhedu ecinezelwe kunye kwaye inike amandla okwaneleyo e-peel yefoyile yobhedu.(Jonga kwiTheyibhile 1)
Usetyenziso
Ingasetyenziselwa iimveliso eziphezulu ze-frequency kunye ne-laminates yangaphakathi, njengezikhululo zesiseko se-5G kunye ne-radar yemoto kunye nezinye izixhobo.
Iingenelo
Ukomelela okuhle kokuhlangana, ukulanywa kwemigangatho emininzi ngokuthe ngqo, kunye nokusebenza kakuhle kwe-etching.Kwakhona kunciphisa amandla okujikeleza okufutshane kunye nokunciphisa ixesha lomjikelezo wenkqubo.
Uluhlu 1. Ukusebenza
Ukuhlelwa | Iyunithi | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
Cu Umxholo | % | imiz.99.8 | |||
Ubunzima beNdawo | g/m2 | 107±3 | 153±5 | 283±5 | |
Tensile strength | RT(25℃) | Kg/mm2 | imiz.28.0 | ||
HT(180℃) | imiz.15.0 | imiz.15.0 | imiz.18.0 | ||
Elongation | RT(25℃) | % | imiz.5.0 | imiz.6.0 | imiz.8.0 |
HT(180℃) | imiz.6.0 | ||||
Uburhabaxa | Shiny(Ra) | μm | max.0.6/4.0 | max.0.7/5.0 | max.0.8/6.0 |
IMatte(Rz) | max.0.6/4.0 | max.0.7/5.0 | max.0.8/6.0 | ||
Amandla e-Peel | RT(23℃) | Kg/cm | imiz.1.1 | imiz.1.2 | imiz.1.5 |
Izinga elithotyiweyo leHCΦ(18%-1hr/25℃) | % | max.5.0 | |||
Ukutshintsha kombala(E-1.0hr/190℃) | % | Akukho nanye | |||
ISolder edadayo 290℃ | Isiqendu. | max.20 | |||
Umngxuma wokuqhafaza | EA | Unothi | |||
Preperg | ---- | FR-4 |
Phawula:1. Ixabiso le-Rz lefoyile yobhedu lixabiso elizinzileyo lovavanyo, hayi ixabiso eliqinisekisiweyo.
2. Amandla e-Peel yixabiso eliqhelekileyo lokuvavanya ibhodi ye-FR-4 (amaphepha ama-5 e-7628PP).
3. Ixesha lokuqinisekiswa komgangatho ziintsuku ezingama-90 ukususela kumhla wokufunyanwa kwayo.