[RTF] Reverse Treated ED Copper Foil

Inkcazelo emfutshane:

RTF, rgqithiunyangoifoyile yobhedu ye-electrolytic yifoyile yobhedu eye yarhaxwa ngamaqondo ahlukeneyo macala omabini.Oku komeleza amandla e-peel kumacala omabini efoyile yobhedu, okwenza kube lula ukuyisebenzisa njengomaleko ophakathi wokudibanisa kwezinye izinto.Ngaphezu koko, amanqanaba ahlukeneyo onyango kumacala omabini e-foil yobhedu enza kube lula ukubeka icala elincinci le-roughened layer.Kwinkqubo yokwenza ibhodi yesekethe eprintiweyo (PCB) iphaneli, icala eliphathwayo lobhedu lisetyenziswe kwizinto ze-dielectric.Icala legubu eliphathwayo lirhabaxa kunelinye icala, elenza ukuncamathela okukhulu kwidielectric.Le yeyona nzuzo iphambili ngaphezu kobhedu oluqhelekileyo lwe-electrolytic.Icala le-matte alifuni naluphi na unyango lomatshini okanye lwekhemikhali ngaphambi kokusetyenziswa kwe-photoresist.Sele rhabaxa ngokwaneleyo ukuba laminating elungileyo ukumelana adhesion.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Intshayelelo yeMveliso

I-RTF, ifoyile yobhedu ephathwayo ye-electrolytic yifoyile yobhedu eye yarhabaxa ukuya kumaqondo ahlukeneyo macala omabini.Oku komeleza amandla e-peel kumacala omabini efoyile yobhedu, okwenza kube lula ukuyisebenzisa njengomaleko ophakathi wokudibanisa kwezinye izinto.Ngaphezu koko, amanqanaba ahlukeneyo onyango kumacala omabini e-foil yobhedu enza kube lula ukubeka icala elincinci le-roughened layer.Kwinkqubo yokwenza ibhodi yesekethe eprintiweyo (PCB) iphaneli, icala eliphathwayo lobhedu lisetyenziswe kwizinto ze-dielectric.Icala legubu eliphathwayo lirhabaxa kunelinye icala, elenza ukuncamathela okukhulu kwidielectric.Le yeyona nzuzo iphambili ngaphezu kobhedu oluqhelekileyo lwe-electrolytic.Icala le-matte alifuni naluphi na unyango lomatshini okanye lwekhemikhali ngaphambi kokusetyenziswa kwe-photoresist.Sele rhabaxa ngokwaneleyo ukuba laminating elungileyo ukumelana adhesion.

Iinkcukacha

I-CIVEN inokubonelela nge-RTF yefoyile yobhedu ye-electrolytic enobunzima obuyi-12 ukuya kwi-35µm ukuya kuthi ga kwi-1295mm ububanzi.

Ukusebenza

Ubude beqondo lobushushu obuphakamileyo obubuyiselwe umva ifoyile yobhedu ye-electrolytic ephathwayo iphantsi kwenkqubo echanekileyo yokucwenga ukulawula ubungakanani bamathumba obhedu kwaye uwasasaze ngokulinganayo.Umphezulu otshintshiweyo okhanyayo wefoyile yobhedu unokunciphisa kakhulu uburhabaxa befoyile yobhedu ecinezelwe kunye kwaye inike amandla okwaneleyo e-peel yefoyile yobhedu.(Jonga kwiTheyibhile 1)

Usetyenziso

Ingasetyenziselwa iimveliso eziphezulu ze-frequency kunye ne-laminates yangaphakathi, njengezikhululo zesiseko se-5G kunye ne-radar yemoto kunye nezinye izixhobo.

Iingenelo

Ukomelela okuhle kokuhlangana, ukulanywa kwemigangatho emininzi ngokuthe ngqo, kunye nokusebenza kakuhle kwe-etching.Kwakhona kunciphisa amandla okujikeleza okufutshane kunye nokunciphisa ixesha lomjikelezo wenkqubo.

Uluhlu 1. Ukusebenza

Ukuhlelwa

Iyunithi

1/3OZ

(12μm)

1/2OZ

(18μm)

1OZ

(35μm)

Cu Umxholo

%

imiz.99.8

Ubunzima beNdawo

g/m2

107±3

153±5

283±5

Tensile strength

RT(25℃)

Kg/mm2

imiz.28.0

HT(180℃)

imiz.15.0

imiz.15.0

imiz.18.0

Elongation

RT(25℃)

%

imiz.5.0

imiz.6.0

imiz.8.0

HT(180℃)

imiz.6.0

Uburhabaxa

Shiny(Ra)

μm

max.0.6/4.0

max.0.7/5.0

max.0.8/6.0

IMatte(Rz)

max.0.6/4.0

max.0.7/5.0

max.0.8/6.0

Amandla e-Peel

RT(23℃)

Kg/cm

imiz.1.1

imiz.1.2

imiz.1.5

Izinga elithotyiweyo leHCΦ(18%-1hr/25℃)

%

max.5.0

Ukutshintsha kombala(E-1.0hr/190℃)

%

Akukho nanye

ISolder edadayo 290℃

Isiqendu.

max.20

Umngxuma wokuqhafaza

EA

Unothi

Preperg

----

FR-4

Phawula:1. Ixabiso le-Rz lefoyile yobhedu lixabiso elizinzileyo lovavanyo, hayi ixabiso eliqinisekisiweyo.

2. Amandla e-Peel yixabiso eliqhelekileyo lokuvavanya ibhodi ye-FR-4 (amaphepha ama-5 e-7628PP).

3. Ixesha lokuqinisekiswa komgangatho ziintsuku ezingama-90 ukususela kumhla wokufunyanwa kwayo.


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