I-Field Copper
Intshayelelo Intshayelelo
I-STD ye-STD yobhedu oveliswe yi-civen inyibiliki ye-civen ayinayo kuphela impumelelo yombane, kodwa kulula uku-etch kwaye kungasebenzi kakuhle kwi-etch kunye nokuphazamiseka okusebenzayo. Inkqubo yemveliso yombane ivumela ububanzi obuninzi beemitha eziyi-1.2 okanye ngaphezulu, ukuvumela izicelo eziguqukayo kuluhlu olubanzi lwamabala. I-foliper yobhedu ngokwayo inemilo efihlakeleyo kakhulu kwaye inokwabumba ngokugqibeleleyo kwezinye izinto. I-foil yobhedu ikwanyangeka kwiqondo lokushisa eliphezulu kunye nokusula, kuyenza ilungele ukusetyenziswa kwiindawo ezinobunzima okanye iimveliso ezineemfuno zobomi eziphathekayo.
Inkcazo
I-civen inokubonelela nge-1 / 3oz-4oz (ubutshintsho -
Intsebenzo
Ayisiyo kuphela ipropathi ebalaseleyo yomzimba yekristali efanelekileyo, iprofayili ephantsi, amandla aphezulu kunye nokungaxhathisi bemichiza, kwaye ilungele amaza okhuseleko, kwaye ucinezela amaza omculo, njl.
Izicelo
Ilungele izithuthi, amandla ombane, unxibelelwano, emkhosini, i-aerospace kunye nenye iBhodi ePhakamileyo yeBhodi, iiKholeji zeBhodi, iZithuthi, ezonyango, ezoMkhosi kunye nezinye iimveliso ze-elektroniki ezikhuselayo.
Izibonelelo
1, Ngenxa yenkqubo ekhethekileyo yokuqengqeleka kwethu, inokuthintela ngokufanelekileyo ukuqhekeka kombane.
2, kuba ubume beenkozo zeemveliso zethu bulingana ne-crystal ye-crystal elungileyo, inqabile ixesha lokuhamba kunye nokuphucula ingxaki ye-etching yendawo engalinganiyo.
3, Xa wayenamandla aphezulu e-peel, akukho tshintsho lomgubo wobhedu, ukucaciswa kwemizobo ye-PCB ye-PCB.
Intsebenzo (GB / T5230-230-230, IPC-4562-2000)
Ukwahlulahlula | Iyunithi | 9μm | 12μm | 18μm | 35M | I-50μm | I-70μ | I-105μm | |
Umxholo we-CU | % | ≥99.8 | |||||||
Indawo ye-seigth | g / m2 | I-80 ± 3 | I-107 ± 3 | I-153 ± 5 | I-283 ± 7 | I-440 ± 8 | I-585 ± 10 | I-875 ± 15 | |
Tensile strength | RT (23 ℃) | Kg / mm2 | ≥28 | ||||||
Ht (180 ℃) | ≥15 | ≥18 | ≥20 | ||||||
I-elongwation | RT (23 ℃) | % | ≥5.0 | ≥6.0 | ≥10 | ||||
Ht (180 ℃) | ≥6.0 | ≥8.0 | |||||||
Rhabaxa | Shinya (ra) | μm | ≤0.43 | ||||||
Matte (rz) | ≤3.5 | ||||||||
Amandla e-Peel | RT (23 ℃) | Kg / cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.0 | ≥1.5 | ≥2.0 |
Ixabiso le-HCφ (18% -1hr / 25 ℃) | % | ≤7.0 | |||||||
Ukutshintsha kombala (E-1.0hr / 200 ℃) | % | Kulungile | |||||||
Umthengisi Ukubetha 290 ℃ | Sec. | ≥20 | |||||||
Inkangeleko (ibala kunye ne-powriver powder) | ---- | Akukho | |||||||
Pinhole | EA | Unothi | |||||||
Ubungakanani bokunyamezelana | Ububanzi | 0 ~ 2mm | 0 ~ 2mm | ||||||
Ubude | ---- | ---- | |||||||
Core | Mm / intshi | Ngaphakathi kwe-76mm / 3 intshi |
Phawula:I-1. Ixabiso le-RZ loMgangatho wobhedu lwe-foll ross lixabiso elizinzileyo lovavanyo, hayi ixabiso eliqinisekisiweyo.
I-2. Amandla e-Peel yixabiso lovavanyo lweBhodi (i-5 yeeshiti ezingama-7628pp).
3. Ixesha lokuqinisekiswa komgangatho ziintsuku ezingama-90 ukusuka kumhla wokufunyanwa.