[RTF] Ifoyile yeCopper ye-ED elungisiweyo ebuyiselwe umva
![[RTF] Umfanekiso obonisiweyo weFoyile yeCopper ye-ED eTyalwe ngoBuyiselo](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Intshayelelo yeMveliso
I-RTF, i-electrolytic copper foil ephathwa ngasemva yi-copper foil eqokelelwe ngamaqondo ahlukeneyo kumacala omabini. Oku kuqinisa amandla okuxobuka kumacala omabini e-copper foil, okwenza kube lula ukuyisebenzisa njengomaleko ophakathi wokubopha kwezinye izinto. Ngaphezu koko, amanqanaba ahlukeneyo onyango kumacala omabini e-copper foil enza kube lula ukukrola icala elincinci lomaleko oqokelelwe. Kwinkqubo yokwenza iphaneli yebhodi yesekethe eprintiweyo (PCB), icala eliphathweyo lobhedu lisetyenziswa kwizinto ze-dielectric. Icala ledrama eliphathweyo liqokelelwe ngakumbi kunelinye icala, nto leyo eyenza ukunamathela okukhulu kwi-dielectric. Le yeyona nzuzo iphambili kune-electrolytic copper eqhelekileyo. Icala eli-matte alifuni naluphi na unyango lwe-mechanical okanye lwe-chemical ngaphambi kokusetyenziswa kwe-photoresist. Sele liqokelelwe ngokwaneleyo ukuba libe nokunamathela okuhle kwe-laminating resist.
Iinkcukacha
I-CIVEN inokubonelela nge-RTF electrolytic copper foil enobukhulu obuqhelekileyo obuyi-12 ukuya kwi-35µm ukuya kuthi ga kwi-1295mm ububanzi.
Ukusebenza
Ifoyile yekopolo elahliwe nge-electrolytic elahliwe ngobushushu obuphezulu ifakwa kwinkqubo echanekileyo yokugquma ukuze kulawulwe ubukhulu beethumba zekopolo kwaye zisasazwe ngokulinganayo. Umphezulu okhanyayo olahliwe nge-copper foil unokunciphisa kakhulu uburhabaxa befoyile yekopolo ecinezelweyo kunye kwaye unike amandla aneleyo okugquma kwefoyile yekopolo. (Jonga iTheyibhile 1)
Izicelo
Ingasetyenziselwa iimveliso ezisebenzisa i-high-frequency kunye ne-inner laminates, njengezikhululo zesiseko ze-5G kunye ne-automotive radar kunye nezinye izixhobo.
Iingenelo
Amandla okubopha afanelekileyo, i-lamination ethe ngqo ye-multi-layer, kunye nokusebenza kakuhle kwe-etching. Ikwanciphisa amandla okujikeleza okufutshane kwaye inciphisa ixesha lomjikelo wenkqubo.
Itheyibhile 1. Ukusebenza
| Ulwahlulo | Iyunithi | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Umxholo weCu | % | ubuncinci 99.8 | |||
| Ubunzima bendawo | g/m2 | 107±3 | 153±5 | 283±5 | |
| Tensile strength | I-RT(25℃) | kg/mm2 | ubuncinci 28.0 | ||
| I-HT(180℃) | ubuncinci be-15.0 | ubuncinci be-15.0 | ubuncinci be-18.0 | ||
| Ukwandiswa | I-RT(25℃) | % | ubuncinci 5.0 | ubuncinci 6.0 | ubuncinci 8.0 |
| I-HT(180℃) | ubuncinci 6.0 | ||||
| Uburhabaxa | Shiny(Ra) | μm | ubuninzi. 0.6/4.0 | ubuninzi. 0.7/5.0 | ubuninzi. 0.8/6.0 |
| I-Matte(Rz) | ubuninzi. 0.6/4.0 | ubuninzi. 0.7/5.0 | ubuninzi. 0.8/6.0 | ||
| Amandla okuKhuhla | I-RT(23℃) | kg/cm | umzuzu 1.1 | umzuzu 1.2 | umzuzu 1.5 |
| Izinga le-HCΦ eliphantsi (18%-1hr/25℃) | % | ubuninzi. 5.0 | |||
| Utshintsho lombala (E-1.0hr/190℃) | % | Akukho nanye | |||
| I-Solder Floating 290℃ | Isek. | ubuninzi. 20 | |||
| Umngxuma wepinhole | EA | Unothi | |||
| Preperg | ---- | FR-4 | |||
Phawula:1. Ixabiso le-Rz lomphezulu we-copper foil lixabiso elizinzileyo lovavanyo, aliloxabiso eliqinisekisiweyo.
2. Amandla okuxobuka lixabiso eliqhelekileyo lovavanyo lwebhodi ye-FR-4 (amaphepha ama-5 e-7628PP).
3. Ixesha lokuqinisekisa umgangatho ziintsuku ezingama-90 ukususela kumhla wokufunyanwa.
![[HTE] I-ED Copper Foil ende kakhulu](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[BCF] Ibhetri ye-ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] I-ED Copper Foil esezantsi kakhulu](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
