[RTF] Reverse Treated ED Copper Foil
![[RTF] Reverse Treated ED Copper Foil Featured Featured Image](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Intshayelelo yeMveliso
I-RTF, ifoyile yobhedu ephathwayo ye-electrolytic yifoyile yobhedu eye yarhabaxa ukuya kumaqondo ahlukeneyo macala omabini. Oku komeleza amandla e-peel kumacala omabini efoyile yobhedu, okwenza kube lula ukuyisebenzisa njengomaleko ophakathi wokudibanisa kwezinye izinto. Ngaphezu koko, amanqanaba ahlukeneyo onyango kumacala omabini efoyile yobhedu enza kube lula ukugalela icala elincinci lomaleko orhabaxa. Kwinkqubo yokwenza ibhodi yesekethe eprintiweyo (PCB) iphaneli, icala eliphathwayo lobhedu lisetyenziswe kwizinto ze-dielectric. Icala legubu eliphathwayo lirhabaxa kunelinye icala, elenza ukuncamathela okukhulu kwidielectric. Le yeyona nzuzo iphambili ngaphezu kobhedu oluqhelekileyo lwe-electrolytic. Icala le-matte alifuni naluphi na unyango lomatshini okanye lwekhemikhali ngaphambi kokusetyenziswa kwe-photoresist. Sele rhabaxa ngokwaneleyo ukuba laminating elungileyo ukumelana adhesion.
Iinkcukacha
I-CIVEN inokubonelela nge-RTF yefoyile yobhedu ye-electrolytic enobunzima obuyi-12 ukuya kwi-35µm ukuya kuthi ga kwi-1295mm ububanzi.
Ukusebenza
Ubude beqondo lobushushu obuphakamileyo obubuyiselwe umva ifoyile yobhedu ye-electrolytic ephathwayo iphantsi kwenkqubo echanekileyo yokucwenga ukulawula ubungakanani bamathumba obhedu kwaye uwasasaze ngokulinganayo. Umphezulu oguqulweyo owenziweyo oqaqambileyo wefoyile yobhedu unokunciphisa kakhulu uburhabaxa befoyile yobhedu ecinezelwe kunye kwaye inike amandla aneleyo e-peel yefoyile yobhedu. (Jonga kwiTheyibhile 1)
Usetyenziso
Ingasetyenziselwa iimveliso eziphezulu ze-frequency kunye ne-laminates yangaphakathi, njengezikhululo zesiseko se-5G kunye ne-radar yemoto kunye nezinye izixhobo.
Iingenelo
Ukomelela okuhle kokuhlangana, ukulanywa kwemigangatho emininzi ngokuthe ngqo, kunye nokusebenza kakuhle kwe-etching. Kwakhona kunciphisa amandla okujikeleza okufutshane kunye nokunciphisa ixesha lomjikelezo wenkqubo.
Uluhlu 1. Ukusebenza
| Ukuhlelwa | Iyunithi | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Cu Umxholo | % | imiz. 99.8 | |||
| Ubunzima beNdawo | g/m2 | 107±3 | 153±5 | 283±5 | |
| Tensile strength | RT(25℃) | Kg/mm2 | imiz. 28.0 | ||
| HT(180℃) | imiz. 15.0 | imiz. 15.0 | imiz. 18.0 | ||
| Ukwandisa | RT(25℃) | % | imiz. 5.0 | imiz. 6.0 | imiz. 8.0 |
| HT(180℃) | imiz. 6.0 | ||||
| Uburhabaxa | Shiny(Ra) | μm | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 |
| IMatte(Rz) | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 | ||
| Amandla e-Peel | RT(23℃) | Kg/cm | imiz. 1.1 | imiz. 1.2 | imiz. 1.5 |
| Izinga elithotyiweyo leHCΦ(18%-1hr/25℃) | % | max. 5.0 | |||
| Ukutshintsha kombala(E-1.0hr/190℃) | % | Akukho nanye | |||
| ISolder edadayo 290℃ | Isiqendu. | max. 20 | |||
| Umngxuma wokuqhafaza | EA | Unothi | |||
| Preperg | ---- | FR-4 | |||
Phawula:1. Ixabiso le-Rz lefoyile yobhedu lixabiso elizinzileyo lovavanyo, hayi ixabiso eliqinisekisiweyo.
2. Amandla e-Peel yixabiso eliqhelekileyo lokuvavanya ibhodi ye-FR-4 (amaphepha ama-5 e-7628PP).
3. Ixesha lokuqinisekiswa komgangatho ziintsuku ezingama-90 ukususela kumhla wokufunyanwa kwayo.
![[BCF] Ibhetri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] Iprofayile ephantsi kakhulu ye-ED Copper Foil](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[HTE] High Elongation ED Copper Foil](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
