Iifoyile zeCopper ze-ED ze-FPC
Intshayelelo yeMveliso
I-FCF, eguquguqukayoifoyile yobhedu yenzelwe ngokukodwa kwaye yenzelwe imboni ye-FPC (FCCL). Le foil yobhedu ye-electrolytic inamandla angcono okubamba, ukuba rhabaxa okuphantsi kunye namandla angcono okuxobuka kuneenye ifoyile yobhedusKwangaxeshanye, ukugqitywa komphezulu kunye nobunzima befoyile yobhedu kungcono kwaye ukumelana nokugoba kubhetele.kwakhonaingcono kuneemveliso ezifanayo zefoyile yobhedu. Ekubeni le foyile yobhedu isekelwe kwinkqubo ye-electrolytic, ayinamafutha, nto leyo eyenza kube lula ukudityaniswa nezinto ze-TPI kumaqondo obushushu aphezulu.
Uluhlu Lobukhulu:
Ubukhulu:9µm～35µm
Ukusebenza
Umphezulu wemveliso umnyama okanye ubomvu, unoburhabaxa obuphantsi bomphezulu.
Izicelo
I-Flexible Copper Clad Laminate (FCCL), i-Fine Circuit FPC, ifilimu ebhityileyo yekristale egqunywe yi-LED.
Iimbonakalo:
Uxinano oluphezulu, ukumelana nokugoba okuphezulu kunye nokusebenza kakuhle kokukrola.
Ulwakhiwo oluncinci:
I-SEM (Icala Elibi emva koNyango)
I-SEM (Ngaphambi koNyango loMphezulu)
I-SEM (Icala Elikhanyayo emva koNyango)
Itheyibhile 1- Ukusebenza (GB/T5230-2000、IPC-4562-2000):
| Ulwahlulo | Iyunithi | 9μm | 12μm | 18μm | 35μm | |
| Umxholo weCu | % | ≥99.8 | ||||
| Ubunzima bendawo | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Tensile strength | I-RT(23℃) | kg/mm2 | ≥28 | |||
| I-HT(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Ukwandiswa | I-RT(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| I-HT(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Uburhabaxa | Shiny(Ra) | μm | ≤0.43 | |||
| I-Matte(Rz) | ≤2.5 | |||||
| Amandla okuKhuhla | I-RT(23℃) | kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Izinga le-HCΦ eliphantsi (18%-1hr/25℃) | % | ≤7.0 | ||||
| Utshintsho lombala (E-1.0hr/200℃) | % | Kulungile | ||||
| I-Solder Floating 290℃ | Isek. | ≥20 | ||||
| Inkangeleko (Ibala kunye nomgubo wobhedu) | ---- | Akukho nanye | ||||
| Umngxuma wepinhole | EA | Unothi | ||||
| Ukunyamezela Ubungakanani | Ububanzi | mm | 0~2mm | |||
| Ubude | mm | ---- | ||||
| Umongo | Mm/intshi | Ububanzi bangaphakathi 79mm/3 intshi | ||||
Qaphela: 1. Ukusebenza kokumelana ne-oxidation ye-copper foil kunye ne-surface density index kungaxoxiswana ngayo.
2. Isalathisi sokusebenza sixhomekeke kwindlela yethu yokuvavanya.
3. Ixesha lesiqinisekiso somgangatho liziintsuku ezingama-90 ukususela kumhla wokufunyanwa.
![[VLP] I-ED Copper Foil esezantsi kakhulu](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Ifoyile yeCopper ye-ED elungisiweyo ebuyiselwe umva](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[HTE] I-ED Copper Foil ende kakhulu](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[BCF] Ibhetri ye-ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
