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I-ED Copper Foils ye-FPC

Iifoyile ze-ED zobhedu ze-FPC Umfanekiso obonakalisiweyo
  • I-ED Copper Foils ye-FPC

Inkcazelo emfutshane:

FCF, bhetyebhetyeifoyile yobhedu iphuhliswe ngokukodwa kwaye yenzelwe ishishini leFPC (FPC). Le foil yobhedu ye-electrolytic ine-ductility engcono, uburhabaxa obusezantsi kunye namandla angcono we-peel kunoenye ifoyile yobhedus. Kwangaxeshanye, ukugqitywa komphezulu kunye nokucoleka kwefoyile yobhedu kungcono kwaye ukuchasana nokusonga kulungekananjalongcono kuneemveliso zobhedu ezifanayo. Ekubeni le foil yobhedu isekelwe kwinkqubo ye-electrolytic, ayinayo igrisi, eyenza kube lula ukudibanisa nezinto ze-TPI kumaqondo aphezulu.


Buza iSample

Iinkcukacha zeMveliso

Iithegi zeMveliso

Intshayelelo yeMveliso

FCF, bhetyebhetyeifoyile yobhedu iphuhliswe ngokukodwa kwaye yenzelwe ishishini leFPC (FPC). Le foil yobhedu ye-electrolytic ine-ductility engcono, uburhabaxa obusezantsi kunye namandla angcono we-peel kunoenye ifoyile yobhedus. Kwangaxeshanye, ukugqitywa komphezulu kunye nokucoleka kwefoyile yobhedu kungcono kwaye ukuchasana nokusonga kulungekananjalongcono kuneemveliso zobhedu ezifanayo. Ekubeni le foil yobhedu isekelwe kwinkqubo ye-electrolytic, ayinayo igrisi, eyenza kube lula ukudibanisa nezinto ze-TPI kumaqondo aphezulu.

Uluhlu lweDimension:

Ukutyeba:9µm～35µm

Ukusebenza

Umphezulu wemveliso umnyama okanye obomvu, unoburhabaxa obusezantsi.

Usetyenziso

I-Flexible Copper Clad Laminate (FCCL), iFine Circuit FPC, ifilimu ecwecwe ngekristale ye-LED.

Iimbonakalo:

Uxinaniso oluphezulu, ukumelana nokugoba okuphezulu kunye nokusebenza kakuhle kwe-etching.

Ulwakhiwo oluncinci:

I-ED Copper Foils ye-FPC3

I-SEM(Icala eliRhawukeleyo emva koNyango)

I-ED Copper Foils ye-FPC2

I-SEM (Ngaphambi koNyango loMphezulu)

I-ED Copper Foils ye-FPC1

I-SEM(Icala Elikhanyayo emva koNyango)

Table1- Performance (GB/T5230-2000、IPC-4562-2000):

Ukuhlelwa

Iyunithi

9μm

12μm

18μm

35μm

Cu Umxholo

%

≥99.8

Ubunzima beNdawo

g/m2

80±3

107±3

153±5

283±7

Tensile strength

RT(23℃)

Kg/mm2

≥28

HT(180℃)

≥15

≥15

≥15

≥18

Elongation

RT(23℃)

%

≥5.0

≥5.0

≥6.0

≥10

HT(180℃)

≥6.0

≥6.0

≥8.0

≥8.0

Uburhabaxa

Shiny(Ra)

μm

≤0.43

IMatte(Rz)

≤2.5

Amandla e-Peel

RT(23℃)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Izinga elithotyiweyo leHCΦ(18%-1hr/25℃)

%

≤7.0

Ukutshintsha kombala(E-1.0hr/200℃)

%

Kulungile

ISolder edadayo 290℃

Isiqendu.

≥20

Imbonakalo (Ibala kunye nomgubo wobhedu)

----

Akukho nanye

Umngxuma wokuqhafaza

EA

Unothi

Ubungakanani Unyamezelo

Ububanzi

mm

0 ~ 2mm

Ubude

mm

----

Undoqo

Mm/intshi

Ngaphakathi Ububanzi 79mm/3 intshi

Qaphela: 1. Ukusebenza kwe-copper foil oxidation resistance and surface density index kungaxoxwa.

2. Isalathisi sokusebenza sixhomekeke kwindlela yethu yokuvavanya.

3. Ixesha lesiqinisekiso somgangatho ziintsuku ezingama-90 ukususela kumhla wokufunyanwa.

  • Ngaphambili:
  • Okulandelayo:
    • Bhala umyalezo wakho apha kwaye uwuthumele kuthi

    Iindidi zeemveliso

    Cofa u-enter ukukhangela okanye i-ESC ukuvala