Ngokuhambela phambili ngokukhawuleza kwetekhnoloji, iimveliso ze-elektroniki ziye zaba yinxalenye ebalulekileyo yobomi bemihla ngemihla yabantu.IiChips, "njengentliziyo" yezixhobo zombane, inyathelo ngalinye kwinkqubo yabo yokuvelisa ibalulekile, kwaye ifoyile yobhedu idlala indima ebalulekileyo kulo lonke ushishino lokwenziwa kwesemiconductor.Ngokuhamba kombane okubalaseleyo kunye ne-thermal conductivity, i-foil yobhedu inoluhlu olubanzi lwezicelo kunye nemisebenzi ebalulekileyo.
Isitshixo kwiiNdlela zokuQhuba
Ifoyile yobheduyenye yezinto eziphambili ezisetyenziselwa ukuveliswa kweebhodi zesekethe eziprintiweyo (PCBs), ezisebenza njengamaqonga okudibanisa iitshiphusi kunye namanye amacandelo e-elektroniki.Kule nkqubo, ifoyile yobhedu iqingqwe ngendlela entsonkothileyo ukuze kudaleke iindlela ezintle zokuqhuba, ezisebenza njengemijelo yomqondiso nokuhanjiswa kwamandla.Kwimveliso ye-semiconductor, nokuba i-micro-connections ngaphakathi kwe-chip okanye ukudibanisa kwihlabathi langaphandle, i-foil yobhedu isebenza njengebhulorho.
Isixhobo kuLawulo lweThermal
Ukuveliswa kobushushu ngexesha lokusebenza kwe-chip akunakuphepheka.Ngokuhamba kakuhle kwe-thermal, i-foil yobhedu idlala indima ebalulekileyo ekulawuleni ukushisa.Iqhuba ngokufanelekileyo ukushisa okwenziwa yi-chip, ukunciphisa umthwalo we-thermal we-chip, ngaloo ndlela ikhusela kumonakalo ogqithiseleyo kunye nokwandisa ubomi bayo.
Ilitye leKona lokuPakisha kunye noQhagamshelwano
Ukupakishwa kwesekethe edityanisiweyo (IC) linyathelo elibalulekileyo ekwenzeni itshiphu, kunyeifoyile yobheduisetyenziselwa ukudibanisa amacandelo amancinci ngaphakathi kwetshiphu kunye nokuseka imidibaniso kunye nehlabathi langaphandle.Olu nxibelelwano alufuni kuphela ukuhanjiswa kombane okugqwesileyo kodwa kunye namandla aneleyo omzimba kunye nokuthembeka, iimfuno ezihambelana ngokugqibeleleyo nefoyile yobhedu.Iqinisekisa ukuba imiqondiso ye-elektroniki inokuhamba ngokukhululekileyo nangokuchanekileyo ngaphakathi nangaphandle kwetshiphu.
Izinto eziKhethekileyo kwii-High-Frequency Applications
Kwitekhnoloji yonxibelelwano lwe-high-frequency efana ne-5G kunye ne-6G ezayo, i-foil yobhedu ibaluleke kakhulu ngenxa yokukwazi ukugcina i-conductivity egqwesileyo kwi-frequencies ephezulu.Iimpawu eziphezulu ze-frequency zibeka iimfuno eziphezulu kwi-conductivity kunye nokuzinza kwezinto eziphathekayo, kwaye ukusetyenziswa kwe-foil yobhedu kuqinisekisa ukusebenza kakuhle kunye nokuzinza kokuhanjiswa kwesignali, okwenza kube yinto efunekayo kwimveliso ye-chips ephezulu.
Imingeni kunye noPhuhliso lwexesha elizayo
Nangonaifoyile yobheduidlala indima ebalulekileyo kwimveliso yetshiphu, njengoko iteknoloji yetshiphu iqhubela phambili isiya kwiminiaturization kunye nokusebenza okuphezulu, iimfuno eziphezulu zibekwe kumgangatho kunye nokusetyenzwa kwetekhnoloji yefoyile yobhedu.Ukutyeba, ukucoceka, ukufana, kunye nokuzinza kokusebenza kwayo phantsi kweemeko ezigqithisileyo yiyo yonke imingeni yobugcisa ekufuneka abavelisi bayoyise.
Ukujonga phambili, ngokuphuhliswa kwezinto ezintsha kunye neenkqubo, ukusetyenziswa kunye nendima yefoyile yobhedu kwishishini lokuvelisa i-semiconductor liya kwandiswa ngakumbi kwaye linzulu.Nokuba kukuphucula ukusebenza kwetshiphu, ukongeza izisombululo zolawulo lwe-thermal, okanye ukuhlangabezana neemfuno zezicelo ze-high-frequency application, i-copper foil iya kuqhubeka idlala indima engenakuphinda ithathelwe indawo, ixhasa inkqubela phambili eqhubekayo kunye nophuhliso lweshishini lokuvelisa i-semiconductor.
Ixesha lokuposa: Mar-28-2024