Ifoyile yobhedu eqengqekileyoIdlala indima ebalulekileyo kumashishini aphucukileyo afana neesekethe ze-elektroniki, iibhetri zamandla amatsha, kunye nokukhusela nge-electromagnetic. Ukusebenza kwayo kunye nokuthembeka kwayo kuxhomekeka ekuchanekeni kwenkqubo yayo yokuvelisa kunye nokuguquguquka kokwenziwa kwayo ngokwezifiso. Eli nqaku liphonononga uhambo olupheleleyo lwemveliso ye-rolledifoyile yobhedungokwembono yobungcali kwaye ichaza indlela enika amandla ngayo amashishini anamhlanje ngezisombululo ezenzelwe wena.
I. Inkqubo yoMveliso eQondisiweyo: Ukulinganisela ukuchaneka nokusebenza kakuhle
1. Ukuphoswa kweCopper Ingot: Indawo yokuqala yobunyulu kunye nolwakhiwo
Ngokusebenzisa ubhedu olucocekileyo kakhulu (≥99.99%), le nto iyanyibilikiswa nge-vacuum kwaye iphoswe rhoqo kwii-ingots ezinobukhulu obuyi-100–200mm. Amanqanaba okupholisa alawulwa ngokungqongqo ukuqinisekisa ukuba iinkozo zincinci, ziyafana kwaye zithintele ukuqhekeka ngexesha lokuqengqeleka okulandelayo.
2. Ukuqengqeleka Okushushu: Inyathelo Lokuqala Lokunciphisa Ubukhulu
Iingots zekopolo zijijelwa zishushu ukuya kwi-5–10mm kwi-700–900°C kusetyenziswa isixhobo sokugaya esiguqukayo. Ukuthambisa okunamandla kunciphisa ukuguguleka kweerola kwaye kunciphisa uxinzelelo lwangaphakathi oluvela ekubunjweni, kubeka isiseko sokujijela ngokuchanekileyo.
3. Ukukha: Ukucoca kunye nokuvuselela umphezulu
Umxube we-nitric-sulfuric acid (10–15% concentration) usetyenziselwa ukususa i-oxidation. Unyango lwe-electro-polishing lunciphisa uburhabaxa bomphezulu (Ra) ukuya ngaphantsi kwe-0.2μm, ukuqinisekisa iziphumo ezisemgangathweni ophezulu ekuqengqelekeni okuqhubekayo.
4. Ukuqengqeleka ngokuchanekileyo: Ukufezekisa ukuchaneka kwenqanaba le-Micron
Iipasi ezininzi zokuqengqeleka okubandayo zinciphisa ubhedu ukuya kwi-0.1–0.2mm. Ngeemill eziqinileyo kakhulu kunye neegeyiji zobukhulu be-laser (±2μm accuracy), umahluko wobukhulu ugcinwa ngaphakathi kwe-1%. Amandla okuqengqeleka kunye noxinzelelo zilawulwa ngononophelo ukuthintela ukuqhekeka komphetho.
5. Ukuqengqeleka kweFoyile: Ukudala iindawo ezibhityileyo kakhulu
Iifektri zefoyile eziphambili zisebenzisa ukulungiswa kwesithuba esincinci kunye nokuthambisa ngeoyile ukuze kufikelelwe kubukhulu obuyi-9–90μm. Ukugqitywa komphezulu kudlula i-ISO 1302 grade 12, ifanelekile kwizicelo ze-5G eziphezulu zempembelelo yesikhumba.
6. Ukususa amafutha: Inyathelo lokugqibela lokuCoca umphezulu
Ukucocwa kwe-ultrasonic kunye nokususwa kwe-alkaline (pH 11–13) kususa i-oyile eqengqelekayo eseleyo. Intsalela yekhabhoni ilawulwa ngaphantsi kwe-5mg/m², nto leyo enika isiseko esicocekileyo sonyango lomphezulu.
7. Ukusika nokupakisha: Ubuchule boShishino obunoMgangatho woBuhle
Iiblade ezigqunywe ngedayimani zifikelela kububanzi obuyi-±0.1mm. Iimveliso zipakishwa nge-vacuum kwifilimu yokulwa ne-oxidation kwaye zigcinwe kwiimeko ezilawulwa yimozulu (25±2°C, ≤70% RH) ukuqinisekisa ukuthunyelwa okuzinzileyo.
II. Ukucubungula Okulungiselelweyo: Ukuphucula Ukusebenza Okuthile Kwishishini
1. Ukudibanisa: Ukwenza ngokwezifiso iiPropati zoMatshini
Ubushushu obuthambileyo (O):Ifakwe kwi-400–600°C phantsi komoya we-H₂/N₂ kangangeeyure ezi-2–4. Amandla okutsalwa ehla aye kwi-200–250MPa kwaye ubude bunyuka bufike kwi-25–40%, nto leyo efanelekileyo kwi-flex circuit dynamic bending.
Umsindo Onzima (H):Igcina amandla aqiniswe ngumsebenzi (400–500MPa), iqinisekisa uzinzo olulinganayo lwe-IC substrates.
2. Unyango Lomphezulu: Ukuphuculwa Komsebenzi
Ukurhawuzelela:Ukugrumba ngeekhemikhali kwenza amaqhuqhuva angama-1–2μm, okwandisa ukunamathela kwe-resin kwi-1.5N/mm okanye ngaphezulu—ukusombulula iingxaki zokwahlulwahlulwa kweebhodi ze-5G.
Isingxobo seNickel/Tin:Iingubo ezizii-0.1–0.3μm zibonelela ngokumelana nokugqwala kwe-10×, zilungele ii-EV battery tabs.
Ukwambathisa okunobushushu obuphezulu:I-Zn nano-coating igcina uzinzo lwefoyile kwi-300°C, ibonelela ngeemfuno zentambo yenqwelo-moya.
III. Ukuxhobisa amashishini abalulekileyo ngokuvelisa izinto ezintsha
Izixhobo zombane:Ifoyile ye-9μm edityaniswe ne-roughening yenza ububanzi bomgca webhodi ye-HDI bube ngaphantsi kwe-12μm, nto leyo enika amandla ukwenziwa kwe-smartphone ibe yincinci.
Iibhetri ze-EV:Ifoyile ethambileyo enobude obuyi-≥20% inyamezela ukugoba kweendlebe okungaphezulu kwama-3000, nto leyo enyusa ukuthembeka kwebhetri.
Ukukhusela i-EMI:Ifoyile ene-nickel ifikelela kwi-120dB shield kwi-10GHz, ifanelekile kwiziseko zophuhliso zeziko ledatha.
IV. I-CIVEN METAL: Ukumisela iMigangatho kwiZisombululo zeFoyile yeCopper ezenziwe ngokwezifiso
Njengenkokeli kwiifoyile yobhedu eqengqiweyoimveliso,Isinyithi Esiyilwe Ngomoyaiphuhlise inkqubo yemveliso eguquguqukayo edibanisa iinkqubo ezimiselweyo kunye nokwenza ngokwezifiso iimodyuli:
Iiworkshops ezicocekileyo kakhulu kunye nolawulo lwe-MES zivumela ubukhulu kunye nokuthamba kwe-±2μm ≤1I.
Izitofu zokufunxa ezinokucwangciswa ziphatha ukuya kuthi ga kwii-odolo ezingama-20 ezizodwa ngaxeshanye.
"Ithala leencwadi lonyango lomphezulu" eliyiproprietary liquka iintlobo ezili-12 zokurhawuzelela kunye neendlela ezisi-8 zokufaka i-electroplating, kunye nemijikelo yokuphendula yeeyure ezingama-72.
Ukulungiswa kwenkqubo kunye nokufunyanwa kwempahla ngobuninzi kunciphisa amaxabiso efoyile eyenziwe ngokwezifiso nge-15–20% xa kuthelekiswa nomndilili wemarike.
Ukususela kwii-ingots zesikali se-millimeter ukuya kwi-foil encinci njenge-micron, ukwenziwa kwe-foil yobhedu olugoqiweyo ngumdaniso wesayensi yezinto eziphathekayo kunye nobunjineli bokuchaneka. Njengoko utshintsho lwe-5G kunye namandla luqhubeka, ziinkampani kuphela ezidibanisa ukuchaneka okuqhelekileyo kunye nokwenza ngokwezifiso okunzulu ezinokuhlala phambili.Isinyithi Esiyilwe Ngomoyauqhuba olu tshintsho, enceda iTshayinaifoyile yobheduishishini linyuka uthotho lwexabiso lwehlabathi.
Ixesha leposi: Novemba-19-2025