Yintoni esinokuyilindela kwi-Copper Foil kuNxibelelwano lwe-5G kwikamva elikufutshane?

Kwixesha elizayo izixhobo zonxibelelwano ze-5G, ukusetyenziswa kwe-foil yobhedu kuya kwandiswa ngakumbi, ngokukodwa kwezi ndawo zilandelayo:

1. Ii-PCBs ezikwi-Frequency High-Frequency (Iibhodi zeSekethe eziShicileleyo)

• I-Loss Low Copper Foil: Isantya esiphezulu sonxibelelwano lwe-5G kunye ne-latency ephantsi idinga iindlela zokuhambisa umqondiso we-high-frequency kwi-design board board, ukubeka iimfuno eziphezulu kwizinto eziphathekayo kunye nokuzinza. I-foil yobhedu yokulahleka ephantsi, kunye nomgangatho wayo othe tye, iyanciphisa ilahleko yokuchasana ngenxa "yempembelelo yesikhumba" ngexesha lokuhanjiswa kwesignali, ukugcina ingqibelelo yesignali. Le foil yobhedu iya kusetyenziswa ngokubanzi kwii-PCB ze-high-frequency kwizikhululo zesiseko ze-5G kunye nee-antenna, ngakumbi ezo zisebenza kwii-millimeter-wave frequencies (ngaphezulu kwe-30GHz).
• I-Foil yeCopper echanekileyo echanekileyo: Ii-antenna kunye neemodyuli ze-RF kwizixhobo ze-5G zifuna izinto ezichanekileyo eziphezulu zokwandisa ukuhanjiswa kwesignali kunye nokusebenza kokufumana. I-conductivity ephezulu kunye ne-machinability yeifoyile yobheduyenze ibe lolona khetho lufanelekileyo kwii-eriyali ezincinci, ezikwi-frequency ephezulu. Kwitekhnoloji ye-5G millimeter-wave, apho ii-eriyali zincinci kwaye zifuna ukusebenza kakuhle kokuhanjiswa komqondiso, i-ultra-thin, i-foil ye-copper echanekileyo ephezulu inokunciphisa kakhulu ukunciphisa umqondiso kunye nokuphucula ukusebenza kwe-eriyali.
• I-Conductor Material yeeSekethe eziguquguqukayo: Ngexesha le-5G, izixhobo zonxibelelwano zihamba zisiya ekubeni zikhaphukhaphu, zincinci, kwaye zibhetyebhetye ngakumbi, ezikhokelela ekusetyenzisweni okubanzi kwee-FPC kwii-smartphones, izixhobo ezinxitywayo, kunye neeterminals zasekhaya ezihlakaniphile. Ifoyile yobhedu, kunye nokuguquguquka okugqwesileyo, ukuhanjiswa, kunye nokumelana nokudinwa, sisixhobo esibalulekileyo sokuqhuba kwimveliso ye-FPC, inceda iisekethe ukuba zifezekise uqhagamshelo olusebenzayo kunye nokuhanjiswa komqondiso ngelixa ihlangabezana neemfuno ezintsonkothileyo zocingo lwe-3D.
• I-Ultra-Thin Copper Foil ye-Multi-Layer HDI PCBs: Itekhnoloji ye-HDI ibalulekile kwi-miniaturization kunye nokusebenza okuphezulu kwezixhobo ze-5G. Ii-PCB ze-HDI zifikelela kwizinga eliphezulu lokuxinana kweesekethe kunye namazinga okudluliselwa kwemiqondiso ngeengcingo ezicolekileyo kunye nemingxuma emincinci. Umkhwa we-ultra-thin copper foil (efana ne-9μm okanye encinci) inceda ukunciphisa ubukhulu bebhodi, ukwandisa isantya sokuhanjiswa kwesignali kunye nokuthembeka, kunye nokunciphisa umngcipheko we-signal crosstalk. Ifoyile yobhedu enje nge-ultra-thin iya kusetyenziswa ngokubanzi kwii-smartphones ze-5G, izikhululo ezisisiseko, kunye nee-routers.
• I-High-Efficiency Thermal Dissipation Copper Foil: Izixhobo ze-5G zivelisa ukushisa okukhulu ngexesha lokusebenza, ngakumbi xa uphatha iimpawu ze-high-frequency kunye nomthamo omkhulu wedatha, obeka iimfuno eziphezulu kulawulo lwe-thermal. I-foil ye-Copper, ene-conductivity egqwesileyo ye-thermal, ingasetyenziselwa kwizakhiwo ze-thermal zezixhobo ze-5G, ezifana namaphepha e-thermal conductive, iifilimu ezilahlayo, okanye i-thermal adhesive layers, inceda ukuhambisa ngokukhawuleza ubushushu ukusuka kumthombo wokushisa ukuya kwi-heat sinks okanye ezinye izinto, ukwandisa uzinzo lwesixhobo kunye nobomi obude.
• Ukusetyenziswa kwiiModyuli zeLTCC: Kwizixhobo zonxibelelwano ze-5G, iteknoloji ye-LTCC isetyenziswa ngokubanzi kwiimodyuli ze-RF zangaphambili, izihlungi, kunye ne-antenna arrays.Ifoyile yobhedu, kunye ne-conductivity yayo egqwesileyo, i-resistantivity ephantsi, kunye nokulula kokulungiswa, isoloko isetyenziswa njengesixhobo somgca we-conductive kwiimodyuli ze-LTCC, ngokukodwa kwiimeko zokudlulisa umqondiso we-speed-speed. Ukongezelela, i-foil yobhedu inokudityaniswa ngezinto ezichasene ne-oxidation ukuphucula ukuzinza nokuthembeka kwayo ngexesha le-LTCC ye-sintering process.
• I-Copper Foil ye-Millimeter-Wave Radar Circuits: I-radar ye-Millimeter-wave inezicelo ezibanzi kwixesha le-5G, kubandakanywa ukuqhuba ngokuzimeleyo kunye nokhuseleko oluhlakaniphile. Ezi rada kufuneka zisebenze kumaza aphezulu kakhulu (ngokuqhelekileyo phakathi kwe-24GHz kunye ne-77GHz).Ifoyile yobheduingasetyenziselwa ukwenza iibhodi zeesekethe zeRF kunye neemodyuli ze-eriyali kwiinkqubo zeradar, zibonelela ngomgangatho obalaseleyo wentembeko kunye nokusebenza kothumelo.

2. Iintenna ezincinci kunye neeModyuli zeRF

3. Iibhodi zeSekethe eziShicileleyo eziGuquguqukayo (FPCs)

4. ITekhnoloji yeTekhnoloji ye-High-Density Interconnect (HDI).

5. Ulawulo lweThermal

6. ITekhnoloji yokuPakisha iTekhnoloji yokuPakisha iTekhnoloji yeTekhnoloji ephantsi yoBubushushu obuphantsi kweCeramic (LTCC).

7. IiNkqubo zeRadar yeMillimeter-Wave

Ngokubanzi, ukusetyenziswa kwe-foil yobhedu kwixesha elizayo izixhobo zonxibelelwano ze-5G ziya kuba zibanzi kwaye zinzulu. Ukusuka kwi-high-frequency signal transmission kunye ne-high-density board board ye-high-density ye-high-density board board to device thermal management and packaging technologies, iipropati zayo ezininzi ezisebenzayo kunye nokusebenza okugqwesileyo kuya kubonelela ngenkxaso ebalulekileyo yokusebenza okuzinzileyo nokusebenzayo kwezixhobo ze-5G.