Ifoyile yobheduinezinga eliphantsi le-oksijeni yomhlaba kwaye inokudibaniswa kunye neentlobo ezahlukeneyo ze-substrates, ezifana nentsimbi, izinto zokukhusela. Kwaye ifoyile yobhedu isetyenziswa ikakhulu kwi-electromagnetic shielding kunye ne-antistatic. Ukubeka i-copper ye-copper foil kwi-substrate surface kwaye idibene ne-metal substrate, iya kubonelela ngokuqhubekayo okugqwesileyo kunye nokukhusela i-electromagnetic. Inokwahlulwa ibe: icwecwe lobhedu oluzincamatheleyo, ifoyile yobhedu yecala elinye, ifoyile yobhedu yecala eliphindwe kabini kunye nokunye okunjalo.

Kwesi sicatshulwa, ukuba uza kufunda ngakumbi malunga nefoyile yobhedu kwinkqubo yokwenziwa kwePCB, nceda ujonge kwaye ufunde umxholo ongezantsi kwesi sicatshulwa ngolwazi olungakumbi lobungcali.

Zeziphi iimpawu zefoyile yobhedu kwimveliso yePCB?

PCB ifoyile yobhedububunzima bokuqala bobhedu obusetyenziswa kumaleko angaphandle nangaphakathi ebhodi yePCB eninzi. Ubunzima bobhedu buchazwa njengobunzima (kwii-ounces) zobhedu ezikhoyo kwindawo enye yesikwere yendawo. Le parameter ibonisa ukutyeba ngokubanzi kobhedu kumaleko. I-MADPCB isebenzisa ezi ntsimbi zilandelayo zobunzima bobhedu kwi-PCB yokwenziwa (pre-plate). Ubunzima obulinganiswa nge-oz/ft2. Ubunzima bobhedu obufanelekileyo bunokukhethwa ukuba bulungele imfuno yoyilo.

· Kwimveliso ye-PCB, iifoyile zobhedu zikwimiqulu, eziyibakala le-elektroniki elinobunyulu be-99.7%, kunye nobukhulu be-1/3oz/ft2 (12μm okanye 0.47mil) – 2oz/ft2 (70μm okanye 2.8mil).

· I-copper foil inezinga eliphantsi le-oksijeni yomhlaba kwaye inokuqhotyoshelwa kwangaphambili ngabavelisi be-laminate kwizinto ezahlukeneyo ezisisiseko, ezifana ne-metal core, i-polyimide, i-FR-4, i-PTFE kunye ne-ceramic, ukuvelisa i-laminates ze-copper clad.

· Iyakwazi ukwaziswa kwibhodi ye-multilayer njengefoyile yobhedu ngokwayo phambi kokucinezela.

· Kwimveliso ye-PCB eqhelekileyo, ubukhulu bobhedu bokugqibela kumaleko angaphakathi buhlala bukwifoyile yokuqala yobhedu; Kumaleko angaphandle sibeka ngaphezulu kwe-18-30μm yobhedu kwiindlela ngexesha lenkqubo yokubekwa kwepaneli.

· Ubhedu lwemigangatho yangaphandle yeebhodi ze-multilayer luhlobo lwe-foil yobhedu kwaye lucinezelwe kunye ne-prepregs okanye i-cores. Ukusetyenziswa kunye ne-microvias kwi-HDI PCB, i-foil yobhedu ngokuthe ngqo kwi-RCC (i-resin coated copper).

Kutheni ifoyile yobhedu ifuneka kwimveliso yePCB?

Ifoyile yobhedu yomgangatho we-elektroniki (ubunyulu obungaphezulu kwe-99.7%, ubukhulu be-5um-105um) yenye yezinto ezisisiseko kwishishini le-elektroniki Uphuhliso olukhawulezayo lweshishini lolwazi lombane, ukusetyenziswa kwefoyile yobhedu yodidi lwe-elektroniki luyakhula, iimveliso zisetyenziswa ngokubanzi. kwii-calculator zoshishino, izixhobo zoNxibelelwano, izixhobo ze-QA, iibhetri ze-lithium-ion, iiseti zikamabonwakude zasekuhlaleni, iirekhoda zevidiyo, abadlali beCD, abakhupheli, umnxeba, umoya womoya, ii-elektroniki zeemoto, izixhobo zomdlalo.

Ifoyile yobhedu yoshishinoinokwahlulwa ibe ngamacandelo amabini: ifoyile yobhedu esongiweyo (ifoyile yobhedu yeRA) kunye nefoyile yobhedu ephothiweyo (ifoyile yobhedu ye-ED), apho ifoyile yobhedu yekhalenda ine-ductility elungileyo kunye nezinye iimpawu, yinkqubo yepleyiti ethambileyo yokuqala esetyenziswa ngefoyile yobhedu, ngelixa i-electrolytic copper foil yindleko ephantsi yokuvelisa ifoyile yobhedu. Njengoko i-foil yobhedu eqengqelekayo yinto ebalulekileyo ekrwada yebhodi ethambileyo, ngoko ke iimpawu zekhalenda yefoyile yobhedu kunye notshintsho lwexabiso kwishishini lebhodi elithambileyo linempembelelo ethile.

Yiyiphi imigaqo esisiseko yoyilo lwefoyile yobhedu kwiPCB?

Ngaba uyazi ukuba iibhodi zeesekethe eziprintiweyo zixhaphake kakhulu kwiqela le-elektroniki? Ndiqinisekile ukuba enye ikhona kwisixhobo sombane osisebenzisayo ngoku. Nangona kunjalo, ukusebenzisa ezi zixhobo zombane ngaphandle kokuqonda itekhnoloji yazo kunye nendlela yokuyila ikwayinto eqhelekileyo. Abantu basebenzisa izixhobo zombane qho ngeyure enye kodwa abazi ukuba zisebenza njani. Ke nazi iindawo eziphambili zePCB ezikhankanyiweyo ukuba zibe nokuqonda ngokukhawuleza ukuba zisebenza njani iibhodi zesekethe eziprintiweyo.

· Ibhodi yesekethe eprintiweyo iibhodi zeplastiki ezilula kunye nokongezwa kweglasi. I-foil yobhedu isetyenziselwa ukulandelela iindlela kwaye ivumela ukuhamba kweentlawulo kunye neempawu ngaphakathi kwesixhobo. Imikhondo yobhedu yindlela yokubonelela ngamandla kumacandelo ahlukeneyo esixhobo sombane. Endaweni yeengcingo, umkhondo wobhedu ukhokela ukuhamba kweentlawulo kwiiPCB.

· IiPCBs zinokuba ngumaleko omnye kunye nemigangatho emibini kwakhona. I-PCB enye enemaleko zezona zilula. Zine-foiling yobhedu kwelinye icala kwaye elinye icala ligumbi lamanye amacandelo. Ngelixa kwi-PCB enamaleko aphindwe kabini, omabini amacala abekelwe ukuphoswa kobhedu. Eziphindwe kabini ziiPCB ezintsonkothileyo ezinemikhondo entsonkothileyo yokuhamba kweentlawulo. Azikho iifoyile zobhedu ezinokuwelana. Ezi PCB ziyafuneka kwizixhobo zombane ezinzima.

· Kukwakho nemigangatho emibini yee-solder kunye nescreen sesilika kwiPCB yobhedu. Isigqubuthelo sobuso sisetyenziselwa ukwahlula umbala wePCB. Kukho imibala emininzi ye-PCB ekhoyo efana neluhlaza, imfusa, ebomvu, njl. njl Ngelixa i-silkscreen iyinxalenye yombhalo wePCB, iileta ezahlukeneyo kunye namanani abhalwa kwiscreen sesilika kumsebenzisi kunye nenjineli.

Unokukhetha njani into efanelekileyo kwifoyile yobhedu kwiPCB?

Njengoko kukhankanyiwe ngaphambili, kufuneka ubone indlela yesinyathelo-nge-nyathelo yokuqonda ipateni yokuvelisa yebhodi yesekethe eprintiweyo. Iimveliso zezi bhodi ziqulethe iindidi ezahlukeneyo. Masiqonde oku ngokulandelelana:

Imathiriyeli yeSubstrate:

Isiseko sesiseko phezu kwebhodi yeplastiki enyanzeliswa ngeglasi yi-substrate. I-substrate yisakhiwo se-dielectric sephepha eliqhelekileyo lenziwe nge-epoxy resins kunye nephepha leglasi. I-substrate iyilwe ngendlela enokuthi ihlangabezane nemfuneko umzekelo ubushushu benguqu (TG).

Lamination:

Njengoko kucacile kwigama, ukuthambisa ikwayindlela yokufumana iipropathi ezifunekayo njengokwandiswa kwe-thermal, amandla okucheba, kunye nobushushu benguqu (TG). I-Lamination yenziwa phantsi koxinzelelo oluphezulu. I-Lamination kunye ne-substrate kunye zidlala indima ebalulekileyo ekuhambeni kweentlawulo zombane kwi-PCB.