I-Electrodeposited (ED)ifoyile yobheduyintsika engabonakaliyo yezixhobo ze-elektroniki zanamhlanje. Iprofayili yayo ebhityileyo kakhulu, ukukwazi kwayo ukusebenza kakuhle, kunye nokuqhuba kwayo kakuhle kwenza ukuba ibe yimfuneko kwiibhetri ze-lithium, ii-PCB, kunye nezixhobo ze-elektroniki eziguquguqukayo.ifoyile yobhedu eqengqiweyo, exhomekeke ekuguqulweni koomatshini,Ifoyile yobhedu ye-EDiveliswa yi-electrochemical deposition, ifezekisa ulawulo lwe-athomu kunye nokwenza ngokwezifiso ukusebenza. Eli nqaku lityhila ukuchaneka kwemveliso yalo kunye nendlela izinto ezintsha zenkqubo eziguqula ngayo amashishini.
I. Imveliso Esemgangathweni: Ukuchaneka koBunjineli be-Electrochemical
1. Ukulungiswa kwe-Electrolyte: Ifomula elungiselelwe i-Nano-Optimized
I-electrolyte esisiseko ine-sulfate yekopolo ecocekileyo kakhulu (80–120g/L Cu²⁺) kunye ne-sulfuric acid (80–150g/L H₂SO₄), kunye ne-gelatin kunye ne-thiourea ezongeziweyo kumanqanaba e-ppm. Iinkqubo ze-DCS eziphucukileyo zilawula ubushushu (45–55°C), izinga lokuhamba (10–15 m³/h), kunye ne-pH (0.8–1.5) ngokuchanekileyo. Izongezo zinamathela kwi-cathode ukuze zikhokele ukwakheka kwengqolowa yenqanaba le-nano kwaye zithintele iziphene.
2. Ukubekwa kweFoyili: Ukusebenza kweAtomic Precision
Kwiiseli ze-electrolytic ezinee-titanium cathode rolls (Ra ≤ 0.1μm) kunye nee-anode ze-lead alloy, i-3000–5000 A/m² DC current iqhuba i-copper ion deposition kumphezulu we-cathode kwi-orientation ye-(220). Ubukhulu be-foil (6–70μm) bulungiswa ngokuchanekileyo ngesantya se-roll (5–20 m/min) kunye nohlengahlengiso lwamandla, nto leyo efikelela kulawulo lobukhulu be-±3%. Eyona foil incinci inokufikelela kwi-4μm—1/20th yobukhulu beenwele zomntu.
3. Ukuhlamba: Iindawo ezicocekileyo kakhulu ngamanzi acocekileyo
Inkqubo yokuhlamba ebuyela umva enamanqanaba amathathu isusa yonke intsalela: Inqanaba loku-1 lisebenzisa amanzi acocekileyo (≤5μS/cm), Inqanaba lesi-2 lisebenzisa amaza e-ultrasonic (40kHz) ukususa iintsalela zezinto eziphilayo, kwaye inqanaba lesi-3 lisebenzisa umoya oshushu (80–100°C) ukomisa ngaphandle kwamachaphaza. Oku kuphumela ekubeniifoyile yobhedukunye namanqanaba eoksijini <100ppm kunye neentsalela zesulfure <0.5μg/cm².
4. Ukusikwa kunye nokuPakisha: Ukuchaneka ukuya kwiMicron yokugqibela
Oomatshini bokusika abakhawulezayo abanolawulo lwe-laser edge baqinisekisa ukuba ububanzi buhlala ngaphakathi kwe-±0.05mm. Ukupakisha okuchasene ne-vacuum anti-oxidation okuneempawu zokufuma kugcina umgangatho womphezulu ngexesha lokuthuthwa nokugcinwa.
II. Ukwenziwa ngokwezifiso koNyango lomphezulu: Ukuvula ukusebenza okuthe ngqo kwishishini
1. Unyango lwe-Roughening: I-Micro-Anchoring yokuphucula i-Bonding
Unyango lweMaqhuqhuva:I-pulse plating kwisisombululo se-CuSO₄-H₂SO₄-As₂O₃ idala amaqhuqhuva angama-2–5μm kumphezulu wefoyile, nto leyo ephucula amandla okunamathela ukuya kwi-1.8–2.5N/mm—ilungele iibhodi zesekethe ze-5G.
Ukurhawuzelela okuphindwe kabini:Amasuntswana ethusi amancinci nanano-scale andisa indawo yomphezulu ngama-300%, nto leyo ephucula ukunamathelana kwe-slurry kwi-anodes zebhetri ye-lithium ngama-40%.
2. I-Functional Plating: I-Molecular-Scale Armor yoKuhlala ixesha elide
Isingxobo seZinc/Tin:Umaleko wesinyithi ongama-0.1–0.3μm wandisa ukumelana nokutshizwa kwetyuwa ukusuka kwiiyure ezi-4 ukuya kwezingama-240, nto leyo eyenza ukuba kube yeyona nto ifanelekileyo kwiibhetri ze-EV.
Ukwaleka kweNickel-Cobalt Alloy:Iileya ze-nano-grain ezifakwe i-pulse-plated (≤50nm) zifikelela kubunzima be-HV350, zixhasa ii-substrates ezigobekayo kwiifowuni ezisongekayo.
3. Ukumelana nobushushu obuphezulu: Ukusinda kwiqondo eligqithisileyo
Iingubo zeSol-gel SiO₂-Al₂O₃ (100–200nm) zinceda ifoyile imelane ne-oxidation kwi-400°C (i-oxidation <1mg/cm²), nto leyo eyenza ukuba ihambelane kakuhle neenkqubo zocingo lweenqwelo-moya.
III. Ukuxhobisa iMida emithathu emikhulu yeShishini
1. Iibhetri zamandla amatsha
Ifoyile ye-CIVEN METAL eyi-3.5μm (≥200MPa tensile, ≥3% longation) yonyusa uxinano lwamandla ebhetri eyi-18650 nge-15%. Ifoyile eneembobo ezenziwe ngokwezifiso (30–50% porosity) inceda ukuthintela ukwakheka kwe-lithium dendrite kwiibhetri ezisemgangathweni.
2. Ii-PCB eziPhambili
Ifoyile ye-low-profile (LP) ene-Rz ≤1.5μm inciphisa ukulahleka kwesiginali kwiibhodi ze-5G millimeter-wave nge-20%. Ifoyile ye-Ultra-low profile (VLP) ene-reverse-treated finish (RTF) ixhasa amazinga edatha e-100Gb/s.
3. Izixhobo zombane eziguquguqukayo
I-AnnealedIfoyile yobhedu ye-ED(≥20% ubude) elaminethiweyo ngeefilimu ze-PI imelana nokugoba okungaphezulu kwama-200,000 (i-radius eyi-1mm), isebenza "njengesiqwenga esiguquguqukayo" sezinto ezinxitywayo.
IV. I-CIVEN METAL: Inkokeli yokwenza ngokwezifiso kwi-ED Copper Foil
Njengendlu enamandla ethuleyo kwi-ED copper foil,Isinyithi Esiyilwe Ngomoyayakhe inkqubo yokuvelisa ekhawulezayo neguquguqukayo:
Ithala leeNcwadi leNano-Additive:Iindidi ezingaphezulu kwama-200 zezongezo ezenzelwe amandla aphezulu okutsalwa, ukunwebeka, kunye nokuzinza kobushushu.
Imveliso yeFoyile ekhokelwa yi-AI:Iiparameters ezilungiselelwe i-AI ziqinisekisa ukuchaneka kobukhulu obuyi-±1.5% kunye nokuba tyaba kwe-≤2I.
Isikhungo Sonyango Lomphezulu:Imigca eli-12 ezinikeleyo enikezela ngeendlela ezingaphezu kwama-20 ezinokwenziwa ngokwezifiso (ukurhawuzelela, ukugquma, ukugquma).
Uyilo lweendleko:Ukubuyiswa kwenkunkuma emgceni kunyusa ukusetyenziswa kobhedu oluluhlaza ukuya kwi-99.8%, kunciphisa iindleko zefoyile eyenziwe ngokwezifiso nge-10–15% ngaphantsi komndilili wemarike.
Ukusuka kulawulo lwe-atomic lattice ukuya ekuhlengahlengiseni ukusebenza kwesikali esikhulu,Ifoyile yobhedu ye-EDimele ixesha elitsha lobunjineli bezinto eziphathekayo. Njengoko utshintsho lwehlabathi oluya ekufakweni kombane kunye nezixhobo ezikrelekrele lukhawuleza,Isinyithi Esiyilwe Ngomoyaikhokela eli qela ngemodeli yalo "yokuchaneka kwe-atomic + uyilo lwesicelo"—ityhalela phambili imveliso yaseTshayina ukuya phezulu kwikhonkco lexabiso lehlabathi.
Ixesha lokuthumela: Juni-03-2025