I-Electrodeposited (ED)ifoyile yobhedungumqolo ongabonakaliyo we-electronics yanamhlanje. Iprofayili yayo ye-ultra-thin, i-ductility ephezulu, kunye ne-conductivity egqwesileyo yenza ukuba kubaluleke kakhulu kwiibhetri ze-lithium, ii-PCB, kunye ne-electronics flexible. Ngokungafaniyoifoyile yobhedu esongwayo, exhomekeke kwi-deformation yomatshini,Ifoyile yobhedu ye-EDiveliswa yi-electrochemical deposition, ukufezekisa ulawulo lwe-atomic-level kunye nokwenza ngokwezifiso ukusebenza. Eli nqaku lityhila ukuchaneka emva kwemveliso yalo kunye nendlela inkqubo entsha yokuguqula amashishini.
I. IMveliso eMiselweyo: Ukuchaneka kubuNjineli be-Electrochemical
1. Ukulungiswa kwe-Electrolyte: I-Nano-Optimized Formula
Isiseko se-electrolyte siqukethe i-sulfate yobhedu ephezulu (80-120g / L Cu²⁺) kunye ne-sulfuric acid (80-150g / L H₂SO₄), kunye ne-gelatin kunye ne-thiourea yongezwa kumanqanaba e-ppm. Iinkqubo ze-DCS ezikwinqanaba eliphezulu zilawula ubushushu (45–55°C), izinga lokuqukuqela (10–15 m³/h), kunye ne-pH (0.8–1.5) ngokuchaneka. I-additives i-adsorb kwi-cathode ukukhokela ukubunjwa kwe-nano-level grain kunye nokuvimbela iziphene.
2. I-Foil Deposition: I-Atomic Precision in Action
Kwiiseli ze-electrolytic ezine-titanium cathode rolls (Ra ≤ 0.1μm) kunye ne-alloy anode ye-alloy, i-3000-5000 A/m² i-DC yangoku iqhuba ukubekwa kwe-ion yobhedu kumphezulu we-cathode kwi-(220) orientation. Ubukhulu beFoil (6–70μm) bulungiswa ngokuchanekileyo ngesantya sokuqengqeleka (5–20 m/min) kunye nohlengahlengiso lwangoku, ukufikelela ± 3% kolawulo lokutyeba. Eyona foil ibhityileyo inokufikelela kwi-4μm—1/20 ubukhulu beenwele zomntu.
3. Ukuhlamba: Imiphezulu ecocekileyo kakhulu enamanzi acocekileyo
Inkqubo yokuhlanjululwa kwamanqanaba amathathu isusa yonke intsalela: Inqanaba le-1 lisebenzisa amanzi acocekileyo (≤5μS / cm), iSigaba 2 sisebenzisa amaza e-ultrasonic (40kHz) ukukhupha izinto eziphilayo, kwaye iSigaba 3 sisebenzisa umoya oshushu (80-100 ° C) ukomisa okungekho ndawo. Oku kubangela ukubaifoyile yobhedungamanqanaba oksijini <100ppm kunye neentsalela zesulfure <0.5μg/cm².
4. Ukuqhawula kunye nokuPakisha: Ukuchaneka kwiMicron yokugqibela
Oomatshini bokuqhawula isantya esiphezulu kunye nolawulo lwe-laser edge baqinisekisa ukunyamezela kobubanzi ngaphakathi kwe-± 0.05mm. Ukupakishwa kwe-vacuum anti-oxidation kunye nezibonakaliso zokufuma zigcina umgangatho womphezulu ngexesha lokuthutha kunye nokugcinwa.
II. ULungiso loNyango oluMphezulu: Ukuvula iNtsebenzo eYodwa kwiShishini
1. Unyango lwe-Roughening: I-Micro-Anchoring ye-Enhanced Bonding
Unyango lwamaqhuqhuva:I-Pulse plating kwi-CuSO₄-H₂SO₄-As₂O₃ isisombululo senza ama-nodules angama-2-5μm kwi-foil surface, ukuphucula amandla okubambelela kwi-1.8-2.5N / mm-efanelekileyo kwiibhodi zeesekethe ze-5G.
I-Dual-Peak Roughening:I-Micro- kunye ne-nano-scale copper particles yandisa indawo ye-300%, iphucula i-slurry adhesion kwi-lithium battery anodes nge-40%.
2. Ukucwenga okuSebenzayo: Isikrweqe seMolekyuli sokuZinza
Ukufakwa kweZinc/Tin:Umaleko wesinyithi we-0.1-0.3μm wandisa uxhathiso lwesitshizi setyuwa ukusuka kwi-4 ukuya kwiiyure ezingama-240, oko kuyenza ibe yindawo yokuya kwii-EV ibhetri.
I-Nickel-Cobalt Alloy Coating:I-Pulse-plated nano-grain layers (≤50nm) ifezekisa ubulukhuni be-HV350, ixhasa ii-substrates ezigobekayo zee-smartphones ezisongekayo.
3. Ukumelana nobushushu obuphezulu: Ukusinda ngokugqithisileyo
I-Sol-gel SiO₂-Al₂O₃ ii-coatings (100-200nm) inceda i-foil ukuxhathisa i-oxidation kwi-400 ° C (i-oxidation <1mg/cm²), iyenza ihambelane ngokugqibeleleyo kwiinkqubo ze-wiring ze-aerospace.
III. UkuXhobisa iMida yoShishino emiThathu emikhulu
1. Iibhetri zaMandla amatsha
Ifoyile yeCIVEN METAL ye-3.5μm (≥200MPa i-tensile, ≥3% elongation) yonyusa amandla ebhetri angama-18650 nge-15%. I-foil ye-custom perforated (30-50% porosity) inceda ukuthintela ukubunjwa kwe-lithium dendrite kwiibhetri eziqinileyo.
2. PCBs Advanced
I-Low-profile (LP) i-foil ene-Rz ≤1.5μm iyanciphisa ukulahleka kwesignali kwiibhodi ze-5G millimeter-wave nge-20%. I-Ultra-low profile (VLP) i-foil ene-reverse-treated finish (RTF) ixhasa amaxabiso edatha ye-100Gb / s.
3. I-Electronics eguquguqukayo
I-AnealedIfoyile yobhedu ye-ED(≥20% elongation) elayitiweyo ngeefilimu zePI imelana ngaphezu kwe-200,000 bend (1mm radius), esebenza "njenge-flexible skeleton" yezinto ezinxitywayo.
IV. I-CIVEN METAL: INkokeli yoLungiso kwi-ED Copper Foil
Njengendlu yamandla ezolileyo kwifoyile yobhedu ye-ED,I-CIVEN METALuye wakha inkqubo yokuvelisa egugileyo, eyimodyuli:
Ithala leencwadi leNano-Additive:Ngaphezulu kwe-200 indibaniselwano eyongezelelweyo eyenzelwe ukomelela okuphezulu, ubude, kunye nokuzinza kwe-thermal.
Imveliso yeFoil ekhokelwa yi-AI:I-AI-optimized parameters iqinisekisa ± 1.5% ukuchaneka kobukhulu kunye ne-≤2I flatness.
IZiko loNyango loMphezulu:Imigca eyi-12 enikezelweyo enikezela nge-20+ iinketho ezinokwenziwa ngokwezifiso (i-roughening, i-plating, i-coatings).
Utshintsho lwexabiso:Ukubuyiswa kwenkunkuma engaphakathi kwandisa ukusetyenziswa kobhedu ekrwada ukuya kwi-99.8%, ukunciphisa iindleko zefoil yesiko nge-10-15% ngaphantsi komyinge wemarike.
Ukusuka kulawulo lwe-athom ye-lattice ukuya kwi-macro-scale performance tuning,Ifoyile yobhedu ye-EDimele ixesha elitsha lobunjineli bezinto eziphathekayo. Njengoko inguqu yehlabathi ekufakeni umbane kunye nezixhobo ezikrelekrele zikhawuleza,I-CIVEN METALikhokela intlawulo ngemodeli yayo “yokuchaneka kweathom + yokwenziwa kwezinto ezintsha”—ukutyhalela imveliso yaseTshayina ibe phezulu kwikhonkco lexabiso lehlabathi.
Ixesha lokuposa: Jun-03-2025