Ukunyangwa emva kokunyangwa kweFoil yeCopper: "I-Anchor Lock" iTekhnoloji yesiNxulumaniso kunye noHlalutyo oluBanzi lweSicelo

Kwintsimi yeifoyile yobheduimveliso, roughening post-unyango yinkqubo engundoqo yokuvula ujongano lwemathiriyeli bonding amandla. Eli nqaku lihlalutya imfuneko yonyango lwe-roughening ukusuka kwiimbono ezintathu: umphumo we-anchoring womatshini, iindlela zokuphunyezwa kwenkqubo, kunye nokuguquguquka kokuphela kokusetyenziswa. Ikwahlola nexabiso lesicelo sale teknoloji kwiinkalo ezifana nonxibelelwano lwe-5G kunye neebhetri zamandla amatsha, ngokusekelweI-CIVEN METAL's iimpumelelo zobugcisa.

1. Unyango olurhabaxa: Ukusuka kwi-“Smooth Trap” ukuya kwi-“Anchored Interface”

1.1 Iziphene eziBalulekileyo zoMphezulu oGudileyo

Uburhabaxa bokuqala (Ra) beifoyile yobheduimiphezulu iqhele ukuba ngaphantsi kwe-0.3μm, nto leyo ekhokelela kule miba ilandelayo ngenxa yeempawu ezifana nesipili:

• Ukungonelanga koQhagamshelwano loMzimba: Indawo yoqhagamshelwano kunye ne-resin kuphela i-60-70% yexabiso lethiyori.
• Imiqobo yoBonding yeMichiza: I-dense oxide layer (Cu₂O ubukhulu malunga ne-3-5nm) ithintela ukuvezwa kwamaqela asebenzayo.
• Ukuvakalelwa koxinzelelo lweThermal: Ukwahluka kwi-CTE (i-Coefficient of thermal Expansion) inokubangela i-interface delamination (ΔCTE = 12ppm / ° C).

1.2 IiNtshukumo eziNtathu eziPhambili kwezobuGcisa kwiiNkqubo zokuRhungula

Ngokwenza i-micron-level-three-dimensional structure (jonga uMfanekiso 1), umaleko orhabaxa ufezekisa:

• Mechanical Interlocking: I-resin yokungena iifom "barbed" i-anchoring (ubunzulu> 5μm).
• Ukusebenza kweMichiza: Ukuveza (111) iinqwelomoya zekristale ezinomsebenzi ophezulu zonyusa uxinano lwendawo yokudibanisa kwiisayithi eziyi-10⁵/μm².
• Uxinzelelo lwe-Thermal Buffering: Isakhiwo se-porous sithatha ngaphezu kwe-60% yoxinzelelo lwe-thermal.
• Indlela yeNkqubo: Isisombululo se-Acidic copper plating (CuSO₄ 80g / L, H₂SO₄ 100g / L) + I-Pulse Electro-deposition (umjikelezo womsebenzi we-30%, i-frequency 100Hz)
• Iimpawu zoLwakhiwo:
  • Ubude be-dendrite yobhedu 1.2-1.8μm, ububanzi 0.5-1.2μm.
  • Umxholo we-oxygen womphezulu ≤200ppm (uhlalutyo lwe-XPS).
  • Ukuchasana noQhagamshelwano <0.8mΩ·cm².
• Indlela yeNkqubo: Isisombululo se-Cobalt-nickel se-alloy (Co²+ 15g/L, Ni²+ 10g/L) + I-Chemical Displacement Reaction (pH 2.5-3.0)
• Iimpawu zoLwakhiwo:
  • Ubungakanani besuntswana le-CoNi i-alloy 0.3-0.8μm, ubuninzi bokupakisha > 8×10⁴ amasuntswana/mm².
  • Umxholo we-oxygen emphezulu ≤150ppm.
  • Ukuchasana noqhagamshelwano <0.5mΩ·cm².

2. I-Oxidation eBomvu vs. I-Oxidation emnyama: Iimfihlo zeNkqubo emva kweMibala

2.1 I-Oxidation eBomvu: “Isikrweqe” seCopper

2.2 I-Oxidation emnyama: Ingxubevange “yeSikrweqe”

2.3 Ingqiqo yezoRhwebo ngasemva kokuKhethwa koMbala

Nangona izalathisi eziphambili zokusebenza (ukuncamathela kunye nokuhanjiswa) kwe-oxidation ebomvu nemnyama yahluka ngaphantsi kwe-10%, imarike ibonisa umahluko ocacileyo:

• I-Foil ye-Copper ene-Oxidized ebomvu: Iiakhawunti ze-60% yesabelo semarike ngenxa yenzuzo enkulu yeendleko (12 CNY/m² vs. emnyama 18 CNY/m²).
• I-Black Oxidized Copper Foil: Ilawula imarike yesiphelo esiphezulu (i-FPC enyuswe ngemoto, ii-millimeter-wave PCBs) ngesabelo semarike esingama-75% ngenxa:
  • I-15% yokunciphisa ilahleko eziphezulu ze-frequency (Df = 0.008 vs. oxidation ebomvu 0.0095 kwi-10GHz).
  • I-30% iphucule i-CAF (i-Conductive Anodic Filament) ukuxhathisa.

3. I-CIVEN METAL: "I-Nano-Level Masters" ye-Roughening Technology

3.1 ITekhnoloji ye “Gradient Roughening” entsha

Ngolawulo lwenkqubo enamanqanaba amathathu,I-CIVEN METALulungisa ubume bomphezulu (jonga uMfanekiso 2):

1. Imbewu yeNano-Crystalline: Electro-deposition of cores cores 5-10nm ngobukhulu, density > 1×10¹¹ amasuntswana/cm².
2. Ukukhula kweMicron Dendrite: I-Pulse yangoku ilawula i-dendrite orientation (ibeka phambili i-(110) isalathiso).
3. Ukugqithiswa komphezulu: I-ejenti yokudibanisa i-silane ye-Organic (i-APTES) iphucula ukuxhathisa i-oxidation.

3.2 Umsebenzi Owogqitha iMigangatho yoShishino

3.3 Ukuphela kokusetyenziswa kweMatrix yosetyenziso

• 5G Base Station PCB: Isebenzisa i-foil yobhedu emnyama oxidized (Ra = 1.5μm) ukuphumeza <0.15dB/cm ilahleko yokufaka kwi-28GHz.
• Abaqokeleli bebhetri yaMandla: I-Oxidized ebomvuifoyile yobhedu(amandla e-tensile 380MPa) inika ubomi bomjikelo> Imijikelo ye-2000 (imijikelo ye-1500 yomgangatho wesizwe).
• IiFPC zeAerospace: Umaleko orhabaxa umelana nomothuko we-thermal ukusuka kwi -196 ° C ukuya +200 ° C kwimijikelo eyi-100 ngaphandle kokuphazamiseka.

4. Ithafa leDabi leKamva leFoil yeKopha eRhawuliweyo

4.1 ITekhnoloji yoBuchule bokuQhuba ngokugqithisileyo

Kwiimfuno zonxibelelwano lwe-terahertz ye-6G, isakhelo se-serrated kunye ne-Ra = 3-5μm siyaphuhliswa:

• Dielectric Constant Stability: Iphuculwe ukuya kwi-ΔDk <0.01 (1-100GHz).
• Ukunyangwa kweThermal: Yehliswe ngama-40% (ukuphumelela i-15W/m·K).

4.2 IiSmart Roughening Systems

Ukufunyanwa kombono odibeneyo we-AI + uhlengahlengiso lwenkqubo eguqukayo:

• Ixesha lokwenyani lokuJonga umphezulu: Isampulu rhoqo 100 izakhelo ngesekhondi.
• Uhlengahlengiso lwangoku loXinano: Ukuchaneka ±0.5A/dm².

Ifoyile yobhedu eyenza rhabaxa emva konyango iye yavela “kwinkqubo yokhetho” ukuya “kumsebenzi ophindaphindayo.” Ngokusebenzisa inkqubo entsha kunye nolawulo lomgangatho ogqithisileyo,I-CIVEN METALityhale itekhnoloji erhabaxayo ukuya kwinqanaba leatom yokuchaneka, ibonelela ngenkxaso yemathiriyeli esisiseko kuphuculo lweshishini lombane. Kwixesha elizayo, kugqatso lobuchule, ubuxhakaxhaka obuphezulu, kunye nobuchwephesha obuthembeke ngakumbi, nabani na olawula "ikhowudi yenqanaba elincinci" letekhnoloji ye-roughening uya kulawula umhlaba ophakamileyo weqhinga.ifoyile yobheduishishini.

(Umthombo wedatha:I-CIVEN METALIngxelo yoNyaka ye-2023 yezobuGcisa, IPC-4562A-2020, IEC 61249-2-21)