I-Passivation yinkqubo engundoqo kwimveliso ye-rolledifoyile yobhedu. Isebenza "njengekhaka le-molecular-level" kumphezulu, iphucula ukuxhathisa ukubola ngelixa ilungelelanisa ngononophelo impembelelo yayo kwiipropati ezibalulekileyo ezifana ne-conductivity kunye ne-solderability. Eli nqaku lijonge kwisayensi emva kweendlela zokuphumelela, ukurhweba ngokusebenza, kunye neendlela zobunjineli. UkusebenzisaI-CIVEN METALUkuphumelela njengomzekelo, siza kuphonononga ixabiso layo elikhethekileyo kwimveliso yombane ephezulu.
1. I-Passivation: "I-Molecular-Level Shield" ye-Copper Foil
1.1 Ulwakhiwo lwePassivation oluFometha njani
Ngokusetyenziswa kweekhemikhali okanye unyango lwe-electrochemical, umaleko we-compact oxide 10-50nm iifom ezishinyeneyo kumphezulu womhlaba.ifoyile yobhedu. Idityaniswe ikakhulu yiCu₂O, CuO, kunye nezinto eziphilayo, olu maleko lubonelela:
- Imiqobo yaseMzimbeni:Umlinganiselo wokusasazwa kweoksijini wehla ukuya ku-1×10⁻¹⁴ cm²/s (ezantsi ukusuka ku-5×10⁻⁸ cm²/s kubhedu olungenanto).
- I-Electrochemical Passivation:Uxinaniso lwangoku lokubola luhla ukusuka kwi-10μA/cm² ukuya ku-0.1μA/cm².
- Ukungangeni kweMichiza:Umphezulu wamandla asimahla athotyiwe ukusuka kwi-72mJ/m² ukuya kwi-35mJ/m², ukucinezela indlela yokuziphatha esebenzayo.
1.2 Izinto eziNzuzo eziNhlanu eziphambili zokuPasa
| Umba wokuSebenza | Ifoyile yobhedu enganyangwanga | Passivated Copper Foil | Uphuculo |
| Uvavanyo lwesitshizi setyuwa (iiyure) | 24 (amabala abonakalayo erusi) | 500 (akukho mhlwa ubonakalayo) | + 1983% |
| Ubushushu obuphezulu (150°C) | Iiyure ezi-2 (ujika ube mnyama) | Iiyure ezingama-48 (zigcina umbala) | +2300% |
| Ubomi bokuGcina | Iinyanga ezi-3 (i-vacuum-packed) | Iinyanga ezili-18 (zipakishwe ngokusemgangathweni) | +500% |
| Ukuchasa uQhagamshelwano (mΩ) | 0.25 | 0.26 (+4%) | - |
| Ilahleko yokuFaka okuPhakamileyo (10GHz) | 0.15dB/cm | 0.16dB/cm (+6.7%) | - |
2. “Ikrele Elintlangothi-mbini” leMaleko ePassivation—Nendlela Yokulinganisa
2.1 Uvavanyo loMngcipheko
- UkuNcitshiswa okuncinci kwi-Conductivity:Umaleko we-passivation wonyusa ubunzulu bolusu (kwi-10GHz) ukusuka kwi-0.66μm ukuya kwi-0.72μm, kodwa ngokugcina ubukhulu obungaphantsi kwe-30nm, ukunyuka kwe-resistivity kunokukhawulelwa phantsi kwe-5%.
- Imingeni yokuSoda:Amandla angaphantsi komhlaba anyusa ii-engile zokumanzisa kwi-solder ukusuka kwi-15° ukuya kwi-25°. Ukusebenzisa iipasti ze-solder ezisebenzayo (uhlobo lwe-RA) lunokuphelisa le mpembelelo.
- Imiba yokuncamathela:Amandla e-resin bonding angehla nge-10-15%, enokuthi incitshiswe ngokudibanisa ukurhabaxa kunye neenkqubo zokudlula.
2.2I-CIVEN METALIndlela yokulungelelanisa
Itekhnoloji yeGradient Passivation:
- Uluhlu olusisiseko:Ukukhula kwe-Electrochemical ye-5nm Cu₂O kunye (111) uqhelaniso olukhethwayo.
- Uluhlu oluPhakathi:Ifilimu edibeneyo ye-2-3nm benzotriazole (BTA).
- Umaleko wangaphandle:I-agent yokudibanisa i-Silane (APTES) ukunyusa ukunamathela kwe-resin.
Iziphumo zoMsebenzi oLundisiweyo:
| Metric | IPC-4562 Iimfuno | I-CIVEN METALIziphumo zeFoil yobhedu |
| Ukuxhathisa uMphezulu (mΩ/sq) | ≤300 | 220–250 |
| Amandla ePeel (N/cm) | ≥0.8 | 1.2–1.5 |
| ISolder Joint Tensile Strength (MPa) | ≥25 | 28–32 |
| Ireyithi yokuFuduka kwe-Ionic (μg/cm²) | ≤0.5 | 0.2–0.3 |
3. I-CIVEN METAL's Passivation Technology: Ukuchaza kwakhona iMigangatho yoKhuselo
3.1 Inkqubo yoKhuseleko lwamaNqana amane
- Ulawulo lwe-oksidi eNcinci kakhulu:I-Pulse anodization ifezekisa ukuguquguquka kobuninzi ngaphakathi kwe-±2nm.
- I-Organic-Inorganic Hybrid Layers:I-BTA kunye ne-silane zisebenza kunye ukunciphisa izinga lokubola ukuya kwi-0.003mm / ngonyaka.
- Unyango lokuVuselelwa komphezulu:Ukucoca i-Plasma (i-Ar/O₂ i-gas mix) ibuyisela i-solder wetting angles kwi-18 °.
- Ukubeka iliso ngexesha lokwenyani:I-Ellipsometry iqinisekisa ukugqithiswa komgangatho ngaphakathi kwe-± 0.5nm.
3.2 Ungqinisiso lweNdalo eNgamandla
- Ukufuma okuphezulu kunye nobushushu:Emva kweeyure ze-1,000 kwi-85 ° C / 85% ye-RH, ukuchasana komphezulu kutshintsha ngaphantsi kwe-3%.
- Ukothuka kweThermal:Emva kwemijikelezo ye-200 ye -55 ° C ukuya + 125 ° C, akukho ziqhekeko zivela kwi-passivation layer (eqinisekiswe yi-SEM).
- Ukumelana neMichiza:Ukuxhathisa kwi-10% umphunga weHCl uyenyuka ukusuka kwimizuzu emi-5 ukuya kwimizuzu engama-30.
3.3 Ukuhambelana kuzo zonke izicelo
- Iintenna ze-5G Millimeter-Wave:I-28GHz ilahleko yokufaka iyancipha ukuya kwi-0.17dB / cm kuphela (xa kuthelekiswa nokhuphiswano lwe-0.21dB / cm).
- Umbane weeMoto:Upasa i-ISO 16750-4 iimvavanyo zokutshiza ityuwa, kunye nemijikelo eyandisiweyo ukuya kwi-100.
- I-IC Substrates:Amandla okubambelela kunye ne-ABF resin ifikelela kwi-1.8N / cm (i-industry average: 1.2N / cm).
4. Ikamva leTekhnoloji yePassivation
4.1 ITekhnoloji yoMaleko weAtomic (ALD).
Ukuphuhlisa iifilimu ze-nanolaminate passivation ezisekwe kwi-Al₂O₃/TiO₂:
- Ukutyeba:<5nm, kunye nokunyuka kwe-resistiveivity ≤1%.
- I-CAF (i-Conductive Anodic Filament) Ukuxhathisa:5x ukuphuculwa.
4.2 IiNqanaba zokuZiphilisa ngokuziphilisa
Ukubandakanya i-microcapsule corrosion inhibitors (i-benzimidazole derivatives):
- Ukuziphilisa ngokuSebenzayo:Ngaphezulu kwe-90% kwiiyure ezingama-24 emva kwemikrwelo.
- Ubomi Benkonzo:Yandiswe kwiminyaka eyi-20 (xa kuthelekiswa nomgangatho we-10-15 iminyaka).
Isiphelo:
Unyango lwe-passivation lufezekisa ibhalansi esulungekileyo phakathi kokukhuselwa kunye nokusebenza kokuqengqelekaifoyile yobhedu. Ngokusungula izinto ezintsha,I-CIVEN METALinciphisa ama-downsides we-passivation, iguqule ibe "sisikrweqe esingabonakaliyo" esonyusa ukuthembeka kwemveliso. Njengoko ishishini lombane lisiya kuxinaniso oluphezulu kunye nokuthembeka, ukunyanzeliswa okuchanekileyo kunye nokulawulwayo kuye kwaba sisiseko sokwenziwa kwefoyile yobhedu.
Ixesha lokuposa: Mar-03-2025