Ubhedu sesinye sezona ntsimbi zisebenza ngeendlela ezininzi ehlabathini. Iimpawu zayo ezikhethekileyo zenza ukuba zilungele uluhlu olubanzi lwezicelo, kubandakanywa ukuqhutyelwa kombane. I-Copper isetyenziswa kakhulu kumashishini ombane kunye ne-electronics, kwaye iifoyile zobhedu ziyinxalenye ebalulekileyo yokuvelisa iibhodi zesekethe eziprintiweyo (PCBs). Phakathi kweentlobo ezahlukeneyo zeefoyile zobhedu ezisetyenziselwa ukuveliswa kwe-PCBs, i-ED ye-copper foil iyona isetyenziswa kakhulu.
I-ED ye-copper foil iveliswa yi-electro-deposition (ED), eyinkqubo ebandakanya ukubekwa kwee-athomu zobhedu kumphezulu wesinyithi ngokusebenzisa umsinga wombane. Ifoyile yobhedu enesiphumo icocekile kakhulu, iyafana, kwaye ineempawu ezigqwesileyo ngoomatshini nezombane.
Enye yeenzuzo eziphambili ze-ED ye-copper foil kukufana kwayo. Inkqubo ye-electro-deposition iqinisekisa ukuba ubukhulu be-foil yobhedu buhambelana kuyo yonke indawo yayo, ebaluleke kakhulu kwimveliso ye-PCB. Ubukhulu befoyile yobhedu ngokuqhelekileyo bucaciswe kwii-microns, kwaye bunokuqala ukusuka kwii-microns ezimbalwa ukuya kumashumi amaninzi e-microns, kuxhomekeke kwisicelo. Ubunzima befoyile yobhedu bumisela ukuhanjiswa kombane, kwaye ifoyile etyebileyo ngokuqhelekileyo inokuqhuba okuphezulu.
Ukongeza kokufana kwayo, i-ED ye-copper foil ineempawu ezintle kakhulu zoomatshini. Ibhetyebhetye kakhulu kwaye inokugotywa ngokulula, ukubunjwa, kunye nokubunjwa ukuze ilingane iikhonto zePCB. Oku bhetyebhetye kuyenza ibe yimathiriyeli efanelekileyo yokwenza iiPCBs ezinejometri ezintsonkothileyo kunye noyilo oluntsonkothileyo. Ngaphezu koko, i-ductility ephezulu ye-foil yobhedu ivumela ukuba imelane nokugoba ngokuphindaphindiweyo kunye nokuguquguquka ngaphandle kokuqhekeka okanye ukuphuka.
Enye ipropati ebalulekileyo ye-ED ye-copper foil yi-conductivity yayo yombane. I-Copper yenye yezona zinyithi ezihamba phambili, kunye ne-ED ye-copper foil ine-conductivity engaphezu kwe-5 × 10 ^ 7 S / m. Eli nqanaba liphezulu le-conductivity liyimfuneko ekuveliseni ii-PCB, apho yenza ukuba ukuhanjiswa kwemiqondiso yombane phakathi kwamacandelo. Ngaphezu koko, ukunyanzeliswa kombane ophantsi we-foil yobhedu kunciphisa ukulahlekelwa kwamandla omqondiso, okubaluleke kakhulu kwizicelo ezikhawulezayo kunye ne-high-frequency applications.
Ifoyile yobhedu ye-ED nayo ixhathisa kakhulu kwi-oxidation kunye nokubola. Ubhedu lusabelana neoksijini emoyeni ukwenza umaleko obhityileyo we-copper oxide kumphezulu wayo, onokubeka esichengeni ukuhanjiswa kwawo kombane. Nangona kunjalo, i-ED ye-copper foil idla ngokugqunywa ngomaleko wezinto ezikhuselayo, ezifana ne-tin okanye i-nickel, ukukhusela i-oxidation kunye nokuphucula ukuthengiswa kwayo.
Ukuqukumbela, i-ED ye-copper foil yinto eguquguqukayo kwaye iyimfuneko ekuveliseni ii-PCBs. Ukufana kwayo, ukuguquguquka, ukuhanjiswa kombane okuphezulu, kunye nokuchasana ne-oxidation kunye nokuhlwa kuyenza ibe yinto efanelekileyo yokuvelisa ii-PCB ezinejometri ezintsonkothileyo kunye neemfuno zokusebenza okuphezulu. Ngemfuno ekhulayo ye-high-speed kunye ne-high-frequency electronics, ukubaluleka kwe-foil yobhedu ye-ED kumiselwe kuphela ukunyuka kwiminyaka ezayo.
Ixesha lokuposa: Feb-17-2023