Inkcankca yenkcenkce ibonelela “ngesikrweqe sesinyithi esiqinileyo”ifoyile yobhedu, ukubetha ibhalansi egqibeleleyo phakathi kokuthengiswa, ukuxhathisa ukubola, kunye nokusebenza kakuhle kweendleko. Eli nqaku lichaza indlela i-tin-plated copper foil ibe yinto engundoqo kubathengi kunye ne-automotive electronics. Iqaqambisa iindlela eziphambili zokubopha iathom, iinkqubo ezintsha, kunye nokusetyenziswa kokuphela, ngelixa uphonononga.I-CIVEN METALUkuqhubela phambili kwitekhnoloji yokucoca ngetoti.
1. Izinto eziNzuzo eziNtathu eziphambili zokuPlayitha iTin
1.1 I-Quantum Leap kwi-Soldering Performance
Umaleko wetin (malunga ne-2.0μm ubukhulu) uguqula i-solder ngeendlela ezininzi:
- I-Lower-Lower Soldering: Itoti inyibilika kwi-231.9°C, inciphisa iqondo lobushushu bobhedu ukusuka ku-850°C ukuya kutsho nje kuma-250–300°C.
- Ukumanzisa okuphuculweyo: Uxinzelelo lomphezulu we-Tin wehla ukusuka kwi-1.3N/m yobhedu ukuya kwi-0.5N/m, ukwandisa indawo yokusasazeka kwe-solder ngama-80%.
- Ii-IMCs ezilungiselelweyo (Ii-Intermetallic Compounds): Umaleko we-Cu₆Sn₅/Cu₃Sn gradient wonyusa amandla okucheba ukuya kuma-45MPa (i-soldering yobhedu engenanto ifezekisa kuphela i-28MPa).
1.2 Ukumelana noKutya: “Isithintelo esiDynamic”
| Imeko yoMhlwa | Ixesha lokungaphumeleli kweCopper | Ixesha lokungaphumeleli kweTin-Plated Copper | Umba woKhuselo |
| Umoya woShishino | Iinyanga ezi-6 (umhlwa oluhlaza) | Iminyaka eyi-5 (ukulahlekelwa kwesisindo <2%) | 10x |
| I-Sweat Corrosion (pH=5) | Iiyure ezingama-72 (ukugqobhoza) | Iiyure ze-1,500 (akukho monakalo) | 20x |
| IHydrogen Sulfide Corrosion | Iiyure ezingama-48 (zimnyama) | Iiyure ezingama-800 (akukho kuguqulwa kombala) | 16x |
1.3 Ukuqhuba: Isicwangciso-qhinga “seMicro-Sacrifice”
- Ukuxhathisa kombane kwandisa kuphela kancinane, nge-12% (1.72×10⁻⁸ ukuya kwi-1.93×10⁻⁸ Ω·m).
- Umphumo wolusu uphucula: Kwi-10GHz, ubunzulu besikhumba bunyuka ukusuka kwi-0.66μm ukuya kwi-0.72μm, okubangela ukulahlekelwa kwelahleko yokunyuka kwe-0.02dB / cm nje.
2. Inkqubo yemiceli mngeni: "Ukusika ngokuchasene noPlating"
2.1 Ukucwangciswa okugcweleyo (Ukusikwa phambi kokucwangciswa)
- Izinto eziluncedo: Imiphetho igutyungelwe ngokupheleleyo, akukho bhedu lutyhilekileyo.
- Imingeni yobuGcisa:
- Iibhula mazilawulwe ngaphantsi kwe-5μm (iinkqubo zemveli zingaphezu kwe-15μm).
- Isisombululo seplating kufuneka singene ngaphezu kwe-50μm ukuqinisekisa ukugquma komphetho ofanayo.
2.2 Ukucwangciswa kwasemva kokusikwa (UkuTyala phambi kokusikwa)
- IiNzuzo zeendleko: Yandisa ukusebenza kakuhle nge-30%.
- Imiba Ebalulekileyo:
- Imiphetho yobhedu eveziweyo isukela kwi-100–200μm.
- Ubomi bokutshiza ngetyuwa buncitshiswe ngama-40% (ukusuka kwiiyure ezingama-2,000 ukuya kwiiyure ezingama-1,200).
2.3I-CIVEN METAL's “Zero-isiphene” Indlela
Ukudibanisa ukusika ngokuchanekileyo kwe-laser kunye ne-pulse tin plating:
- Ukuchaneka kokusika: Iibhula zigcinwe ngaphantsi kwe-2μm (Ra=0.1μm).
- I-Edge Coverage: Icala lokutyabeka ubukhulu ≥0.3μm.
- Iindleko-Ukusebenza: Iindleko ze-18% ngaphantsi kuneendlela zemveli zokucwenga.
3. I-CIVEN METALI-Tin-PlatedIfoyile yobhedu: Umtshato weNzululwazi kunye ne-Aesthetics
3.1 Ulawulo oluchanekileyo lwe-Coating Morphology
| Uhlobo | Inkqubo Parameters | Iimpawu eziphambili |
| ITin Eqaqambileyo | Uxinaniso lwangoku: 2A/dm², ukongeza A-2036 | Ukubonakaliswa > 85%, Ra=0.05μm |
| Matte Tin | Uxinzelelo lwangoku: 0.8A/dm², akukho zongezo | Reflectivity <30%, Ra=0.8μm |
3.2 Iimetriki zoMsebenzi oPhezulu
| Imilinganiselo | Umndilili woShishino |I-CIVEN METALTin-Plated Copper | Uphuculo |
| Ukutenxa ukutyeba koMaleko (%) | ±20 | ±5 | -75% |
| Ixabiso le-Solder Void (%) | 8–12 | ≤3 | -67% |
| Bend Resistance (imijikelo) | 500 (R=1mm) | 1,500 | + 200% |
| Ukukhula Kwe-Tin Whisker (μm/1,000h) | 10–15 | ≤2 | -80% |
3.3 IiNkalo eziPhambili zokuSebenza
- IiFPC ze-smartphone: I-Matte tin (ubukhulu be-0.8μm) iqinisekisa i-soldering ezinzileyo ye-30μm yomgca / isithuba.
- ECUs zeemoto: I-tin eqaqambileyo imelana ne-3,000 ye-thermal cycles (-40 ° C↔ + 125 ° C) ngaphandle kokungaphumeleli kwe-solder joint.
- Iibhokisi ze-Photovoltaic Junction: I-tin-side-side plating (1.2μm) ifezekisa ukuchasana koqhagamshelwano <0.5mΩ, ukunyusa ukusebenza kakuhle nge-0.3%.
4. Ikamva leTin Plating
4.1 I-Nano-Composite Coatings
Ukuphuhlisa iSn-Bi-Ag ternary alloy coatings:
- Indawo yokunyibilika esezantsi ukuya kwi-138°C (ilungele ubushushu obuphantsi be-elektroniki obuguquguqukayo).
- Ukuphucula ukuxhathisa kwe-creep nge-3x (ngaphezu kweeyure ze-10,000 kwi-125 ° C).
4.2
- Izisombululo zeCyanide-Free: Yehlisa i-COD yamanzi amdaka ukusuka kwi-5,000mg/L ukuya kwi-50mg/L.
- Izinga eliphezulu lokuBuyisa iTin: Ngaphezulu kwe-99.9%, iindleko zenkqubo yokusika ngama-25%.
I-tin plating iyatshintshaifoyile yobheduukusuka kumbhexeshi osisiseko ukuya kwi "imathiriyeli yojongano olukrelekrele."I-CIVEN METALUlawulo lwenkqubo yomgangatho we-atom lutyhala ukuthembeka kunye nokomelela kokusingqongileyo kwefoyile yobhedu efakwe kwitoti ukuya kubude obutsha. Njengoko i-elektroniki yabathengi iyancipha kwaye i-elektroniki yemoto ifuna ukuthembeka okuphezulu,i-tin-plated copper foiliba lilitye lembombo lenguquko yoqhagamshelo.
Ixesha lokuposa: May-14-2025