I-Copper Foil Nickel Plating: Ukwakha "iSikrweqe seNano-Level" kunye noBuvulindlela obuManyeneyo obuSebenzayo

I-Nickel plating yinkqubo ebalulekileyo yokuguqulwa komsebenzi eyenza i-nickel-based composite layer elawulwa ngokuchanekileyo, eyenzaifoyile yobheduukugcina uzinzo olukhethekileyo phantsi kweemeko ezinzima. Eli nqaku liphonononga impumelelo kwiifoyile yobhedu ene-nickelitekhnoloji evela kwii-engile ezintathu-i-thermal kunye ne-corrosion protection, i-electromagnetic shielding, kunye nenkqubo entsha. UkusebenzisaI-CIVEN METALItekhnoloji ye-nano-scale nickel yokucwenga njengomzekelo, iqaqambisa ixabiso lemathiriyeli kwimimandla ehambele phambili njengamandla amatsha kunye ne-aerospace.

1. Inkqubo yoKhuseleko oluBini kunye nokuPhuhliswa kokuSebenza kweNickel Plating

1.1 IiNdlela zoMzimba kunye nezeMichiza zoKhuseleko loBuqondo obuPhezulu
Umaleko wenickel (0.1μm obukhulu) unikezela ngokhuseleko lobushushu obuphezulu ngoku:

• Uzinzo lweThermal:I-nickel ineqondo lokunyibilika lika-1455°C (xa kuthelekiswa ne-copper's 1085°C). Kwi-200-400 ° C, izinga le-oxidation yayo yi-1/10 kuphela yobhedu (0.02mg/cm²·h vs. 0.2mg/cm²·h).
• Umqobo wokusasaza:Icinezela imfuduko yeatom yobhedu kumphezulu, yehlisa ulwahlulo lwe-coefficient ukusuka ku-10⁻¹⁴ ukuya ku-10⁻¹⁸ cm²/s.
• Ukunciphisa Uxinzelelo:Nge-coefficient yokwandisa i-thermal ye-13.4ppm / ° C (xa kuthelekiswa nobhedu 17ppm / ° C), inciphisa uxinzelelo lwe-thermal ngama-40%.

1.2 Ukuchasana nokuMhlwa kunye neNkqubo “yoKhuselo oluNcama-ntathu”

2. "Umthetho wegolide" we-0.1μm Coating
2.1 Isiseko sobuNzululwazi sokuphucula ukutyeba
Ukulinganisa okuphelileyo kunye nedatha yovavanyo iqinisekisa ukuba umaleko we-nickel we-0.1μm ubonelela ngebhalansi efanelekileyo:

• Ukuqhuba:Ukuxhathisa konyuka nge-8% kuphela (ukusuka ku-0.017Ω·mm²/m ukuya ku-0.0184Ω·mm²/m).
• Ukusebenza koomatshini:Amandla okuqina ayenyuka aye kuma-450MPa (ukusuka kwi-350MPa yobhedu olungenanto), nobude obushiyekileyo bungaphezulu kwe-15%.
• Ulawulo lweendleko:Ukusetyenziswa kwe-nickel kuncipha nge-90% xa kuthelekiswa neengubo zemveli ze-1μm, ukunciphisa iindleko nge-25 CNY/m².

2.2 “Invisible Shield” Isiphumo sokuKhuselwa ngoMbane
Ubungqingqwa bomaleko we-nickel bunxibelelana ngokuthe ngqo kunye nokusebenza kokhuselo (SE):
SE(dB) = 20 + 50·log₁₀(t/0.1μm)
Kwi-t = 0.1μm, SE = 20dB.
Kwi-1GHz rhoqo:

• UkuKhusela indawo yoMbane:>35dB (iibhloko 99.97% imitha).
• IMagnetic Field Shielding:>28dB (idibana ne-MIL-STD-461G).

3. I-CIVEN METAL: IiMasters zeNano-Precision Nickel Plating
3.1 Ukuphumelela kwezobuGcisa kwi-Electroplating
I-CIVEN METALusebenzisa i-pulse electroplating kunye ne-nano-additive composite techniques:

• IiParameters zePulse:Uxinzelelo lwangoku oluya phambili lwe-3A/dm² (80% yomjikelo womsebenzi), umva wangoku we-0.5A/dm² (20% yomjikelo womsebenzi).
• Ulawulo lweNano-Precision:Idibanisa i-2nm yembewu yenickel (uxinaniso >10¹² amasuntswana/cm²), ukufikelela kubungakanani beenkozo ≤20nm.
• Ukutyeba okufanayo:I-Coefficient of variation (CV) <3% (i-industry average>8%).

3.2 Iimetriki zoMsebenzi oPhezulu

3.3 Izisombululo zokuQamba eziLungisiweyo

• Ukwalekwa kweNickel ecala-linye:Ukutyeba kwe-0.08-0.12μm, ilungele iisekethe eziprintiweyo eziguquguqukayo (FPC).
• I-Nickel Coating enamacala amabini:Ukutyeba kwe-0.1μm±0.02μm, esetyenziswa kubaqokeleli bangoku bebhetri.
• Ukwaleka kweGradient:0.1μm nickel kumphezulu + 0.05μm cobalt utshintsho umaleko, ukuze aerospace-level ukuxhathisa ukothuka thermal.

4. Ukuphela-Ukusetyenziswa kwezicelo zeI-Nickel-Plated Copper Foil

4.1 Iibhetri zaMandla amatsha

• Iibhetri zaMandla:I-Nickel layers inhiba ukukhula kwe-lithium dendrite, ukwandisa ubomi bomjikelo ukuya kwi->2,000 yemijikelo (ubhedu olungenanto: imijikelo eyi-1,200).
• Iibhetri zeState-Solid:Ukuhambelana okuphuculweyo kunye ne-sulfide electrolytes, ukumelana nobuso <5Ω·cm² (ubhedu olungenanto> 20Ω·cm²).

4.2 Umbane we-Aerospace

• Amacandelo eRF yeSatellite:I-Electromagnetic shielding esebenzayo>30dB (Ka band), ilahleko yokufaka <0.1dB/cm.
• Izivamvo zeNjini:Imelana ne-800 ° C yexesha elifutshane lokutshatyalaliswa kwe-thermal ngaphandle kwe-delamination yokwambathisa (i-SEM iqinisekisiwe).

4.3 IZixhobo zobuNjineli baseLwandle

• Izidibanisi eziNxibelela kuLwandle olunzulu:Idlula iimvavanyo zoxinzelelo lwe-3,000-meter ubunzulu (30MPa), ukuxhathisa ukubola ngokuchasene ne-Cl⁻> iminyaka eyi-10.
• Iziqhagamshelo zoMbane woMbane woMoya ngaphandle konxweme:Ubomi bokutshiza ngetyuwa>iiyure ezingama-5,000 (IEC 61701-6 eqhelekileyo).

5. Ikamva le-Nickel Plating Technology

5.1 I-Atomic Layer Deposition (ALD) IiCoatings Composite
Ukuphuhlisa i-Ni/Al₂O₃ nano-laminates:

• Ukuxhathisa iqondo lobushushu:Ukugqithisa i-600 ° C (i-nickel plating yesiqhelo: 400 ° C).
• Ukuxhathisa ukonakala:Ukuphuculwa kwe-5x (ubomi bokutshiza ngetyuwa> iiyure ezingama-10,000).

5.2 IiNgqungquthela zoBukrelekrele eziphendulayo
Ukufakela ii-microcapsules ezibuthathaka kwi-pH:

• Ukukhutshwa kwe-Automatic Inhibitor:I-Benzotriazole-based inhibitors isebenze ngexesha lokubola, kunye nokusebenza kakuhle kokuziphilisa> 85%.
• Ubomi benkonzo eyandisiweyo:Iminyaka eyi-25 (iingubo eziqhelekileyo: iminyaka eyi-10-15).

I-Nickel plating endowsifoyile yobhedukunye "nokuqina okufana nentsimbi" ngelixa ugcina ukusebenza okungaqhelekanga kwiimeko ezinzima. Ngokufezekisa ukuchaneka kwenqanaba le-nano kunye nokubonelela ngeenkqubo ezinokwenzeka,I-CIVEN METALizikhundla nickel-platedifoyile yobhedunjengelitye lembombo kwimveliso ephezulu. Njengoko amandla amatsha kunye nokuphononongwa kwendawo kuhambela phambili,ifoyile yobhedu ene-nickelngokungathandabuzekiyo iya kuhlala iyimathiriyeli yesicwangciso esiyimfuneko.