I-Foil ye-Copper kunye ne-Copper Strip: Uhlalutyo oluBanzi olusuka kwiiNkqubo zeMveliso ukuya kwii-Application Scenarios

Kwintsimi yokwenziwa kwezinto ezisekwe kubhedu, “ifoyile yobhedu” kunye “umcu wobhedu"Kubantu abangengabo abachwephesha, umahluko phakathi kwezi zibini unokubonakala ungowolwimi kuphela, kodwa kwimveliso yoshishino, lo mahluko uchaphazela ngokuthe ngqo ukukhethwa kwezinto, iindlela zenkqubo, kunye nokusebenza kokugqibela kwemveliso. Eli nqaku lihlalutya ngokucwangcisiweyo ukungafani kwabo okusisiseko kwiimbono ezintathu eziphambili: imigangatho yobugcisa, iinkqubo zemveliso, kunye nezicelo zeshishini.

1. Umgangatho wokutyeba: UBuchule boShishino ngasemva kwe-0.1mm Threshold

Ukusuka kwimbono yobunzima,0.1mmngowona mgca ubalulekileyo wokwahlula phakathi kwemicu yobhedu kunye neefoyile zobhedu. IIKhomishini yeHlabathi yoBuchwephesha boMbane (IEC)umgangatho uchaza ngokucacileyo:

• Umtya wobhedu: Izinto zobhedu eziqengqelekayo ngokuqhubekayo kunye nobunzima≥ 0.1mm
• Ifoyile yobhedu: Izinto zethusi ezinobunzima obuphezulu obunobunzima< 0.1mm

Olu lwahlulo alunamkhethe kodwa lusekwe kwiimpawu zokwenziwa kwezinto:
Xa ubukhulu budlula0.1mm, izinto eziphathekayo zifezekisa ibhalansi phakathi kwe-ductility kunye namandla omatshini, okwenza ukuba ilungele ukuqhutyelwa kwesibini njengokunyathela kunye nokugoba. Xa ubukhulu buwela ngaphantsi0.1mm, indlela yokucubungula kufuneka itshintshe kwi-precision rolling, aphoumgangatho womphezulu kunye nokulingana kobukhuluzibe zizalathi ezibalulekileyo.

Kwimveliso yanamhlanje yamashishini, eqhelekileyoumcu wobheduimathiriyeli ngokwesiqhelo iyahluka phakathi0.15mm kunye ne-0.2mm. Umzekelo, kwiiibhetri zamandla emoto entsha (NEV)., 0.18mm umcu wobhedu we-electrolyticisetyenziswa njengento ekrwada. Ngokusebenzisa ngaphezuluIipasile ezingama-20 zokuqengqeleka ngokuchanekileyo, ekugqibeleni icutshungulwa ibe yi-ultra-thinifoyile yobheduukusuka kwi6μm ukuya kwi-12μm, ngokunyamezela ubunzima be±0.5μm.

2. Unyango loMphezulu: Umahluko weTekhnoloji oqhutywa nguMsebenzi

Unyango olusemgangathweni lwemicu yobhedu:

1. Ukucoca ngealkaline – Isusa iintsalela ze-oyile eziqengqelekayo
2. I-Chromate Passivation – Iifom a0.2-0.5μmumaleko okhuselayo
3. Ukomisa kunye nokuBumba

Unyango olomeleziweyo lweFoil yobhedu:

Ukongeza kwiinkqubo ze-copper strip, i-foil yobhedu idlula:

1. Electrolytic Degreasing – Ukusetyenziswa3-5A/dm² uxinano lwangokue50-60°C
2. I-Nano-Level Surface Roughening – Ilawula ixabiso Ra phakathi0.3-0.8μm
3. Anti-Oxidation Silane Unyango

Ezi nkqubo zongezelelweyo zibonelelaiimfuno ezikhethekileyo zokusetyenziswa kokuphela:
In Ukwenziwa kweBhodi yeSekethe eprintiweyo (PCB)., ifoyile yobhedu kufuneka yenze abond molecular-levelkunye ne-resin substrates. Nditshointsalela yeoyile yenqanaba lemicronkunokubangelaiziphene ze-delamination. Idatha evela kumvelisi ophambili wePCB ibonisa ukubai-electrolytic degreased copper foiliyaphucukaKhulula amandla ngama-27%kwaye iyanciphisailahleko yedielectric nge-15%.

3. Ukuma kweshishini: Ukusuka kwiMathiriyeli ekrwada ukuya kwiMathiriyeli eSebenzayo

Umcu wobheduisebenza njenge"umthengisi wezinto ezisisiseko"kwikhonkco lonikezelo, ikakhulu esetyenziswa kwi:

• Izixhobo zamandla: Amajiko eTransformer (0.2-0.3mm ubukhulu)
• Izihlanganisi zoShishino: Amaphepha okuqhuba (0.15-0.25mm ubukhulu)
• Izicelo zoYilo lwezakhiwo: Ukufulela iileya ezingangeni manzi (0.3-0.5mm ubukhulu)

Ngokwahlukileyo koko, i-copper foil iye yavela kwi-a"izinto ezisebenzayo"leyo ayinakuphinda ibuyiselwe kwi:

Ukuthathaiibhetri zamandlanjengomzekelo, iiakhawunti zefoyile yobhedu10-15%yexabiso lemathiriyeli yeseli. Yonke1μm ukunciphisaukutyeba ukwandaUxinzelelo lwamandla ebhetri nge-0.5%. Yiyo loo nto iinkokeli zeshishini zithandaI-CATLbatyhala ifoyile yobhedu ubukhulu ukuya4μm.

4. I-Evolution yeTekhnoloji: Ukudibanisa imida kunye nokuPhuhliswa kokuSebenza

Ngenkqubela phambili kwisayensi yezinto eziphathekayo, umda wemveli phakathi kwefoyile yobhedu kunye nomtya wobhedu uyaguquka ngokuthe ngcembe:

1. I-Ultra-Thin Copper Strip: 0.08mm "quasi-foil" iimvelisongoku zisetyenziselwai-electromagnetic shielding.
2. Ifoyile yobhedu ehlanganisiweyo: 4.5μm ubhedu + 8μm i-polymer substrateyenza "sandwich" isakhiwo esaphula imida yomzimba.
3. Umtya weCopper osebenzayo: Imicu yobhedu enekhabhoni iyavulekaimida emitsha kwiipleyiti zeeseli ze-bipolar.

Ezi zinto zintsha zifunaimigangatho ephezulu yemveliso. Ngokutsho komvelisi omkhulu wobhedu, usebenzisaitekhnoloji ye-magnetron sputteringkuba imicu yobhedu edibeneyo icuthiweUchaso lweyunithi yendawo ngama-40%kwaye iphuculweukugoba ubomi bokudinwa ngamaxesha ama-3.

Isiphelo: Ixabiso elisemva koMsantsa woLwazi

Ukuqonda umahluko phakathiumcu wobhedukwayeifoyile yobheduimalunga nokubamba i"ubungakanani ukuya kumgangatho"utshintsho kubunjineli bezinto eziphathekayo. Isuka e0.1mm ubukhulu bomdaukuyaunyango umphezulu micron-levelkwayeulawulo lojongano lwesikali se-nanometer, impumelelo nganye yetekhnoloji ilungisa imeko yeshishini.

Kwiixesha lokungathathi hlangothi kwekhabhoni, olu lwazi luya kuba nempembelelo ngokuthe ngqoukukhuphisana kwenkampanikwicandelo lemathiriyeli entsha. Ngapha koko, kwiishishini lebhetri lamandla, a0.1mm umsantsa ekuqondeniinokuthetha iisizukulwana sonke somahluko wetekhnoloji.