Ukusetyenziswa kweCopper Foil kwiChip Packaging

Ifoyile yekopoloIbaluleke ngakumbi ekupakisheni iitshiphusi ngenxa yokuqhuba kwayo umbane, ukuqhuba kwayo ubushushu, ukuqhubekeka kwayo, kunye nokusebenza kwayo kakuhle kweendleko. Nantsi uhlalutyo oluneenkcukacha lwezicelo zayo ezithile ekupakisheni iitshiphusisi:

1. Ukubopha ucingo lwekopolo

• Ukutshintshwa kweNtambo yeGolide okanye yeAluminiyamNgokwesiko, iingcingo zegolide okanye ze-aluminium bezisetyenziswa ekupakisheni iitshiphusi ukuze zidibanise ngombane i-circuit yangaphakathi yetshiphusi kwiintambo zangaphandle. Nangona kunjalo, ngenxa yokuqhubela phambili kwetekhnoloji yokucubungula ubhedu kunye nokuqwalaselwa kweendleko, i-copper foil kunye ne-copper wire ziya ziba ziindlela eziqhelekileyo. Ukuqhuba kombane kweCopper kumalunga ne-85-95% kunegolide, kodwa ixabiso layo limalunga nesinye kwishumi, nto leyo eyenza ukuba ibe lukhetho olufanelekileyo lokusebenza kakuhle kunye nokusebenza kakuhle kwezoqoqosho.
• Ukusebenza Kombane Okuphuculweyo: Ukubopha ucingo lwekopolo kunika ukumelana okuphantsi kunye nokuqhuba okungcono kobushushu kwizicelo ezisebenzisa amaza aphezulu kunye nombane ophezulu, kunciphisa ngempumelelo ukulahleka kwamandla kwiintambo zonxibelelwano lweetshiphusi kunye nokuphucula ukusebenza kombane ngokubanzi. Ke ngoko, ukusebenzisa i-copper foil njengesixhobo sokuqhuba kwiinkqubo zokubopha kunokuphucula ukusebenza kakuhle kunye nokuthembeka kokupakishwa ngaphandle kokunyusa iindleko.
• Isetyenziswa kwi-Electrodes kunye ne-Micro-Bumps: Kwiphakheji ye-flip-chip, i-chip iyajikwa ukuze ii-input/output (I/O) pads ezikumphezulu wayo ziqhagamshelwe ngqo kwisekethe ekwi-package substrate. I-copper foil isetyenziselwa ukwenza ii-electrodes kunye nee-micro-bumps, ezithengiswa ngokuthe ngqo kwi-substrate. Ukumelana okuphantsi kobushushu kunye nokuqhuba okuphezulu kobhedu kuqinisekisa ukuhanjiswa kwemiqondiso kunye namandla ngokufanelekileyo.
• Ukuthembeka kunye noLawulo loBushushu: Ngenxa yokuxhathisa kwayo kakuhle kwi-electromigration kunye namandla oomatshini, i-copper inika ukuthembeka okungcono kwexesha elide phantsi kwemijikelo yobushushu eyahlukeneyo kunye noxinano lwangoku. Ukongeza, ukuhanjiswa kobushushu okuphezulu kwe-copper kunceda ukukhupha ngokukhawuleza ubushushu obuveliswa ngexesha lokusebenza kwe-chip kwi-substrate okanye kwi-heat sink, okuphucula amandla olawulo lobushushu lwephakheji.
• Izinto zeSakhelo seNkokeli: Ifoyile yekopoloIsetyenziswa kakhulu ekupakisheni ifreyimu yelead, ingakumbi ekupakisheni izixhobo zamandla. Ifreyimu yelead inika inkxaso yesakhiwo kunye noqhagamshelo lombane kwitship, ifuna izixhobo ezinomoya ophezulu kunye nomoya omhle womoya. Ifoyile yekopolo iyahlangabezana nezi mfuno, inciphisa ngempumelelo iindleko zokupakisha ngelixa iphucula ukusasazwa kobushushu kunye nokusebenza kombane.
• Iindlela Zonyango Lomphezulu: Kwiindlela ezisebenzayo, i-copper foil idla ngokwenziwa unyango oluphezulu olufana ne-nickel, i-tin, okanye i-silver plating ukuthintela i-oxidation kunye nokuphucula ukunyibilikiswa kwe-solder. Olu nyango luphucula ngakumbi ukuqina kunye nokuthembeka kwe-copper foil kwiphakheji yesakhelo se-lead.
• Izinto eziqhubayo kwiimodyuli ze-Multi-Chip: Itekhnoloji yenkqubo-kwiphakheji idibanisa iitships ezininzi kunye nezinto ezingasebenziyo kwiphakheji enye ukuze kufezekiswe ukuhlanganiswa okuphezulu kunye noxinano olusebenzayo. Ifoyile yekopolo isetyenziselwa ukuvelisa iisekethe zokudibanisa zangaphakathi kwaye isebenza njengendlela yokuqhuba yangoku. Olu setyenziso lufuna ifoyile yekopolo ibe nokuqhuba okuphezulu kunye neempawu ezincinci kakhulu ukuze kufezekiswe ukusebenza okuphezulu kwindawo encinci yokupakisha.
• Izicelo ze-RF kunye ne-Millimeter-Wave: Ifoyile yekopolo ikwadlala indima ebalulekileyo kwiisekethe zokudlulisa isignali ezisebenzisa imitha ephezulu kwiSiP, ingakumbi kwizicelo zerediyo (RF) kunye nemilimitha-wave. Iimpawu zayo zokulahleka okuphantsi kunye nokuqhuba kwayo okugqwesileyo kuvumela ukuba inciphise ukuncitshiswa kwesignali ngokufanelekileyo kwaye iphucule ukusebenza kakuhle kokudlulisa kwezi zicelo zemitha ephezulu.
• Isetyenziswa kwiRedistribution Layers (RDL): Kwiphakheji yefeni, ifoyile yekopolo isetyenziselwa ukwakha umaleko wokusasazwa kwakhona, iteknoloji esasaza i-chip I/O kwindawo enkulu. Ukuqhuba okuphezulu kunye nokunamathela okuhle kwefoyile yekopolo kuyenza ibe yinto efanelekileyo yokwakha amaleyile okusasazwa kwakhona, kwandisa uxinano lwe-I/O kunye nokuxhasa ukuhlanganiswa kwee-chip ezininzi.
• Ukunciphisa Ubungakanani kunye noBulungisa beSignali: Ukusetyenziswa kwefoyile yobhedu kwiileya zokusasazwa kwakhona kunceda ukunciphisa ubungakanani bephakheji ngelixa kuphucula ukuthembeka kokudluliselwa kwesignali kunye nesantya, nto leyo ebaluleke kakhulu kwizixhobo eziphathwayo kunye nezicelo zekhompyutha ezisebenzayo kakhulu ezifuna ubungakanani obuncinci bokupakisha kunye nokusebenza okuphezulu.
• Izinki zobushushu zeCopper Foil kunye neeChannels zobushushuNgenxa yokuqhuba kwayo kakuhle kobushushu, i-copper foil idla ngokusetyenziswa kwizinki zobushushu, kwiitshaneli zobushushu, nakwizinto ezisetyenziswa kwi-thermal interface ngaphakathi kwipakethe yeetshiphu ukunceda ukudlulisa ngokukhawuleza ubushushu obuveliswa yitshiphu ukuya kwizakhiwo zangaphandle zokupholisa. Olu setyenziso lubaluleke kakhulu kwiitshiphu ezinamandla aphezulu kunye neepakethe ezifuna ulawulo oluchanekileyo lobushushu, njengee-CPU, ii-GPU, kunye neetshiphu zolawulo lombane.
• Isetyenziswa kwiTekhnoloji yeThrough-Silicon Via (TSV): Kwiteknoloji yokupakisha iitshiphusi ze-2.5D kunye ne-3D, i-copper foil isetyenziselwa ukwenza izinto zokugcwalisa eziqhubayo kwii-vias ze-through-silicon, nto leyo enika unxibelelwano oluthe nkqo phakathi kweetshiphusi. Ukuqhuba okuphezulu kunye nokuqhubekeka kwe-copper foil kuyenza ibe yinto ekhethwayo kwezi teknoloji zokupakisha ziphambili, ixhasa ukuhlanganiswa koxinano oluphezulu kunye neendlela ezimfutshane zesignali, ngaloo ndlela iphucula ukusebenza kwenkqubo iyonke.

2. Ukupakisha ii-Flip-Chip

3. Ukupakishwa kwesakhelo seNkokeli

4. Inkqubo-kwiPhakheji (i-SiP)

5. Ukupakishwa kwefeni

6. Ulawulo lobushushu kunye nezicelo zokusasaza ubushushu

7. Iiteknoloji zokuPakisha eziPhambili (ezifana nokuPakisha kwe-2.5D kunye ne-3D)

Lilonke, ukusetyenziswa kwe-copper foil ekupakisheni ii-chip akupheleli nje ekuqhagamshelweni kwe-conductive yendabuko kunye nolawulo lobushushu kodwa kudlulela nakwiiteknoloji ezintsha zokupakisha ezifana ne-flip-chip, i-system-in-package, i-fan-out packaging, kunye ne-3D packaging. Iimpawu zemisebenzi emininzi kunye nokusebenza kakuhle kwe-copper foil kudlala indima ebalulekileyo ekuphuculeni ukuthembeka, ukusebenza, kunye nokusebenza kakuhle kweendleko zokupakisha ii-chip.