Ukusetyenziswa kweFoil yeCopper kwi-Chip Packaging

Ifoyile yobheduisiya ibaluleke kakhulu ekupakishweni kwetshiphu ngenxa yokuqhutywa kombane, ukuhanjiswa kwe-thermal, ukuqhubekeka, kunye nokusebenza kakuhle kweendleko. Nalu uhlalutyo oluneenkcukacha lwezicelo zalo ezikhethekileyo kwipakethe ye-chip:

1. Ukubotshwa kocingo lweCopper

• Ukutshintshwa kweGolide okanye iAluminiyam yocingo: Ngokwemveli, iingcingo zegolide okanye ze-aluminiyam zisetyenzisiwe kwipakethe yetshiphu ukudibanisa ngombane i-circuit yangaphakathi ye-chip kwiindlela zangaphandle. Nangona kunjalo, ngokuhambela phambili kwitekhnoloji yokucubungula ubhedu kunye nokuqwalaselwa kweendleko, ifoyile yobhedu kunye nocingo lobhedu ngokuthe ngcembe ziba lukhetho oluqhelekileyo. I-copper conductivity yombane imalunga ne-85-95% yegolide, kodwa ixabiso layo limalunga nesinye seshumi, okwenza kube yinto efanelekileyo yokusebenza okuphezulu kunye nokusebenza kakuhle kwezoqoqosho.
• UkuSebenza koMbane okongeziweyo: I-Copper wire bonding inikezela ukuchasana okuphantsi kunye ne-thermal conductivity engcono kwi-high-frequency kunye ne-high-current applications, ukunciphisa ngokufanelekileyo ukulahlekelwa kwamandla kwi-chip interconnections kunye nokuphucula ukusebenza kombane jikelele. Ngaloo ndlela, ukusebenzisa i-foil yobhedu njengento eqhubayo kwiinkqubo zokudibanisa kunokunyusa ukusebenza kakuhle kokupakisha kunye nokuthembeka ngaphandle kokunyuka kweendleko.
• Isetyenziswe kwi-Electrodes kunye ne-Micro-Bumps: Kwi-flip-chip packaging, i-chip ihlanjululwe ukwenzela ukuba i-input / i-output (I / O) iipads kwindawo yayo idibaniswe ngokuthe ngqo kwisiphaluka kwi-substrate yephakheji. I-foil yobhedu isetyenziselwa ukwenza i-electrodes kunye ne-micro-bumps, ezithengiswa ngokuthe ngqo kwi-substrate. Ukuxhatshazwa kwe-thermal ephantsi kunye ne-conductivity ephezulu yobhedu iqinisekisa ukuhanjiswa ngokufanelekileyo kweempawu kunye namandla.
• Ukuthembeka kunye noLawulo lweThermal: Ngenxa yokuchasana kwayo kakuhle ne-electromigration kunye namandla omatshini, ubhedu lubonelela ngokuthembeka okungcono kwexesha elide phantsi komjikelezo we-thermal ohlukeneyo kunye noxinzelelo lwangoku. Ukongezelela, i-copper ephezulu ye-thermal conductivity inceda ngokukhawuleza ukutshatyalaliswa kobushushu obuveliswa ngexesha lokusebenza kwe-chip kwi-substrate okanye i-heat sink, ukuphucula amandla okulawula ukufudumala kwephakheji.
• Lead Frame Material: Ifoyile yobheduisetyenziswa ngokubanzi kwipakethe yesakhelo esikhokelayo, ngakumbi ukupakishwa kwesixhobo samandla. Isakhelo esikhokelayo sibonelela ngenkxaso yesakhiwo kunye nokuxhunywa kombane kwi-chip, efuna izinto ezinomgangatho ophezulu kunye nokuhanjiswa kakuhle kwe-thermal. I-foil ye-Copper ihlangabezana nezi mfuno, inciphisa ngokufanelekileyo iindleko zokupakisha ngelixa iphucula ukuchithwa kwe-thermal kunye nokusebenza kombane.
• IiTeknikhi zoNyango lomphezulu: Kwizinto ezisetyenziswayo, ifoyile yobhedu ihlala isenziwa kunyango olungaphezulu olufana nenickel, itoti, okanye isilivere ecwecwe ukuthintela i-oxidation kunye nokuphucula ukuqina. Olu nyango luqhubela phambili ukomeleza ukuqina kunye nokuthembeka kwefoyile yobhedu ekupakishweni kwesakhelo esikhokelela.
• Izinto zokuqhuba kwiiModyuli ze-Multi-Chip: Itekhnoloji ye-System-in-package idibanisa ii-chips ezininzi kunye namacandelo angenayo kwiphakheji enye ukufezekisa ukudibanisa okuphezulu kunye nokuxinana okusebenzayo. I-foil yobhedu isetyenziselwa ukuvelisa iisekethe zokudibanisa zangaphakathi kwaye zisebenze njengendlela yokuqhuba yangoku. Esi sicelo sidinga i-foil yobhedu ukuba ibe ne-conductivity ephezulu kunye neempawu ze-ultra-thin ukufezekisa ukusebenza okuphezulu kwindawo yokupakisha encinci.
• Izicelo zeRF kunye neMillimeter-Wave: Ifoyile yobhedu ikwadlala indima ebalulekileyo kwiisekethe zokuhanjiswa komqondiso we-frequency ephezulu kwi-SiP, ngakumbi kwirediyo yerediyo (RF) kunye ne-millimeter-wave applications. Iimpawu zayo eziphantsi zelahleko kunye ne-conductivity egqwesileyo zivumela ukuba kuncitshiswe ukunyanzeliswa komqondiso ngokufanelekileyo kunye nokuphucula ukusebenza kakuhle kokuhanjiswa kwezi zicelo eziphezulu ze-frequency.
• Isetyenziswa kwiRedistribution Layers (RDL): Ekupakishweni kwe-fan-out, i-foil yobhedu isetyenziselwa ukwakha i-redistribution layer, iteknoloji ehambisa kwakhona i-chip I / O kwindawo enkulu. I-conductivity ephezulu kunye nokubambelela kakuhle kwe-foil yobhedu kwenza kube yinto efanelekileyo yokwakha iileyile zokusabalalisa ngokutsha, ukwandisa ubuninzi be-I / O kunye nokuxhasa ukuhlanganiswa kwee-chip ezininzi.
• Ukunciphisa ubungakanani kunye neMfezeko yoMqondiso: Ukusetyenziswa kwe-foil yobhedu kwi-redistribution layers kunceda ukunciphisa ubungakanani bephakheji ngelixa uphucula ukuhanjiswa kwesignali ingqibelelo kunye nesantya, esibaluleke kakhulu kwizixhobo eziphathwayo kunye nezicelo eziphezulu zekhompyutheni ezifuna ubungakanani bokupakisha obuncinci kunye nokusebenza okuphezulu.
• I-Copper Foil Heat Sinks kunye ne-Thermal Channels: Ngenxa ye-thermal conductivity egqwesileyo, i-foil yobhedu isetyenziswa rhoqo kwiindawo zokutshisa ukushisa, iziteshi ze-thermal, kunye nezixhobo ze-thermal interface ngaphakathi kokupakishwa kwe-chip ukunceda ngokukhawuleza ukuhambisa ukushisa okwenziwa yi-chip kwizakhiwo zokupholisa zangaphandle. Esi sicelo sibaluleke kakhulu kwiitshiphusi ezinamandla aphezulu kunye neepakethi ezifuna ulawulo oluchanekileyo lobushushu, olunje ngee-CPU, ii-GPU, kunye neetshiphusi zolawulo lwamandla.
• Isetyenziswe kwi-Thry-Silicon Via (TSV) Technology: Kwi-2.5D kunye ne-3D ye-technologi yokupakisha i-chip, i-foil yobhedu isetyenziselwa ukudala izinto zokuzalisa i-conductive ngokusebenzisa i-silicon vias, ukubonelela ukudibanisa okuthe nkqo phakathi kweechips. I-conductivity ephezulu kunye nokuqhubekeka kwe-foil yobhedu yenza kube yinto ekhethwayo kobu buchwepheshe bokupakisha obuphambili, ukuxhasa ukudibanisa okuphezulu kunye neendlela ezimfutshane zesignali, ngaloo ndlela kuphuculwe ukusebenza kwenkqubo jikelele.

2. Ukupakishwa kweFlip-Chip

3. UkuPakisha isakhelo sokukhokela

4. I-System-in-Package (SiP)

5. Fan-Out Packaging

6. Ulawulo lwe-Thermal kunye nezicelo zokuThuthwa kobushushu

7. IiTekhnoloji zokuPakisha eziNqobileyo (ezifana ne-2.5D kunye ne-3D yokuPakisha)

Ngokubanzi, ukusetyenziswa kwefoyile yobhedu kwipakethe ye-chip akukhawulelwanga kuqhagamshelo lwemveli lokuqhuba kunye nolawulo lwe-thermal kodwa ludlulela kubuchwephesha bokupakisha obuvelayo obufana ne-flip-chip, inkqubo-in-package, i-fan-out packaging, kunye nokupakishwa kwe-3D. Iimpawu zemisebenzi emininzi kunye nokusebenza okugqwesileyo kwe-foil yobhedu kudlala indima ephambili ekuphuculeni ukuthembeka, ukusebenza, kunye neendleko ezisebenzayo zokupakisha i-chip.