Ukusetyenziswa kwe-foil ye-foil kwiphakethe ye-chip

I-Copper FoilIya sisiya ibalulekile kwiphakeji ye-Chip ngenxa yokuqhutywa kombane, ukuqhubela phambili kwengqondo, ukuqhubela phambili, kunye nokusebenza ngendleko. Nalu uhlalutyo olucacileyo lwezicelo zalo ezikhethekileyo kwiphakheji ye-chip:

1. Ucingo lobhedu

• Ukutshintshwa kwegolide okanye i-aluminium wire: Ngokwesiko, iingcingo zegolide okanye iingcingo ze-aluminium zisetyenzisiwe kwiphakheji ye-chip yokudibanisa umbane kwi-Chip Picright Apparn Appern yangaphakathi ukuya kwizikhokelo zangaphandle. Nangona kunjalo, ukuqhubela phambili kwitekhnoloji yokuqhubela phambili kobhedu kunye nokuqwalaselwa kweendleko, i-foil yobhedu kunye nocingo lobhedu ngokuthe ngcembe ngokuthe ngcembe. Ukuqhutywa kombane kuPhepha malunga ne-85-95% yegolide, kodwa iindleko zayo zimalunga nesinye seshumi, esenza ukhetho olufanelekileyo lokusebenza okuphezulu kunye nokusebenza kakuhle kwezoqoqosho.
• Ukuphucula ukusebenza kombane: Ucingo lobhedu lubonelela ngokuxhathisa okusezantsi kunye nokuphumeza okungcono kwe-thermal kwi-right-free kunye nezicelo eziphezulu, ngokufanelekileyo ukunciphisa ukulahleka kwamandla kwi-Chip Disctions kunye nokuphucula ukusebenza kombane. Ke, ukusebenzisa ububi bobhedu njengezinto ezibonakalayo kwiinkqubo zokubiyela kunokuphucula ukupakisha ukusebenza kunye nokuthembeka ngaphandle kokunyusa iindleko.
• Isetyenziswe kwi-electrode kunye ne-micro-bumps: Kwipakeji ye-chip-chip-chip ifakwe ukuba igalelo / iziphumo (i / o) iipads zayo zixhumene ngqo kwisekethe kwiphakheji. I-foil ye-Copper isetyenziselwa ukwenza i-electrode kunye ne-micro-tumps, ezithengiswa ngokuthe ngqo kwi-subtate. Ukungaxhathisi okuphantsi kunye nokuzibandakanya okuphezulu kobhedu eqinisekisa ukuhanjiswa ngokufanelekileyo kwamalungu namandla.
• Ukuthembeka kunye nolawulo lobushushu: Ngenxa yokunganyangeki okuhle ku-elektrosition kunye namandla oomatshini, ubhedu lubonelela ngokuthembeka kwexesha elide phantsi kwemijikelezo ye-thermal kunye noxinino lwangoku. Ukongeza, ukuqhubela phambili kwengqondo okuphezulu kwebala kunceda ukungcolisa ngokukhawuleza ubushushu obusebenza kwi-chip kwi-chip kwi-chip kwi-chip kwi-substrate ukuya kwi-substrate okanye i-shart eshushu, ekwandisa amandla olawulo lwephakheji.
• Izinto ezikhokelayo: I-Copper Foilisetyenziswa ngokubanzi kwipakethi yesakhelo esikhokelayo, ngakumbi ukupakishwa kwesixhobo sombane. Isakhelo esikhokelayo sinika inkxaso yolwakhiwo kunye noqhagamshelo lombane kwi-chip, efuna izixhobo zokuphumelela okuphezulu kunye nokuhamba okuhle. I-foil ye-Copper ye-Copper ihlangabezana nezi mfuno, ukunciphisa iindleko zokupakisha ngelixa kuphuculwa ukubekwa kwe-thermal kunye nokusebenza kombane.
• Iindlela zonyango ezingaphezulu: Kwizicelo ezisebenzayo, i-cailper foil ihlala iphantsi konyango olungaphaya kwe-nickel, i-tin, okanye ukubekwa kwesilivere ukuthintela i-oxidation kunye nokuphucula ukunyamezela kwe-oxidation kunye nokuphucula ukunyamezela kwe-oxidation kunye nokuphucula impahla ehlekayo. Olu nyango luqhubeke ngakumbi ukuphucula ukuqina kunye nokuthembeka kwe-foil yobhedu kwipakeji yesakhelo esikhokelayo.
• Izinto ezisebenzayo kwiimodyuli ze-chip ezininzi: Itekhnoloji yenkqubo yephakheji idibanisa i-chips ezininzi kunye nezinto ezihambayo kwiphakheji enye ukuze kufezekiswe ukudityaniswa okuphezulu kunye noxinano olusebenzayo. I-foil ye-Copper isetyenziselwa ukwenza i-proxrithi yangaphakathi yokudibanisa kwaye isebenze njengekhondo lokuhamba ngoku. Esi sicelo sifuna i-foil ye-copper ifuna ukuba nempumelelo ephezulu kunye neempawu ze-ultra ezincinci ukufezekisa intsebenzo ephezulu kwindawo encinci yokupakisha.
• I-RF kunye nezicelo ze-millimeter-wave: I-Copper Foil idlala indima ebalulekileyo kwisekethe esetyenziswayo kwi-SIP, ngakumbi kwi-radio frequency (RF) kunye nezicelo zemilimitha. Iimpawu zalo zokulahleka kwelahleko kunye nokucokisekileyo ngokugqwesileyo kuyayivumela ukuba inciphise ukuntywila ngokufanelekileyo kunye nokuphucula ukusebenza kwempumelelo kwezi zicelo ziphezulu.
• Isetyenziswe kwizinto zokubala (rdl): Kwiphakheji yokuphuma ngaphandle, i-foil yobhedu isetyenziselwa ukwakha isakhiwo sawo, itekhnoloji ehambisa i-chip i / o kwindawo enkulu. Ukuphunyezwa okuphezulu kunye nokunamathela okuphezulu kwe-foil yobhedu kuyenza ibe yinto efanelekileyo yokwakha iindawo zokwakha ngokutsha, ukunyuka i / oxinano kunye nokuxhasa ukudityaniswa kwe-chip ezininzi.
• Ubungakanani bokunciphisa kunye nokunyaniseka komqondiso: Ukusetyenziswa kwe-foil ye-foil kwi-Readridation Iimboleko zinceda ukunciphisa ubungakanani bephakheji ngelixa iphucula isixhobo sokuhambisa isiginali kunye nesantya, esibaluleke kakhulu kwizixhobo ezincinci kunye nokusebenza okuphezulu.
• I-Copper Foil Bush Subs kunye neendlela ze-thermal: Ngenxa yokuqhubela phambili kwengqondo, i-foil yobhedu ihlala isetyenziselwa ukutshisa, iziteshi ze-thermal, kunye nezixhobo ze-thermal, kunye nezixhobo zonxibelelwano kwi-Chip kwiphakheji yokugcina i-chip kwizakhiwo zangaphandle zokupholisa. Esi sicelo sibaluleke ngokukodwa kwiitshipsi zamandla aphezulu kunye neephakeji ezifuna ulawulo lobushushu oluchanekileyo, ezinjenge-CPU, i-GPU, i-GPUSE YOLWAZI LOKUGQIBELA.
• Isetyenziswe kwi-silicon ngetekhnoloji ye (TSV): Kwi-2.,5D kunye ne-3D ye-Chip yeTekimeli, i-foil ye-cowper isetyenziselwa ukwenza izinto ezizenziweyo ze-silicon vias, zibonelela ngonxibelelwano oluthe ngqo phakathi kweetshipsi. Ukuyekelela okuphezulu kunye nokuphuculwa kwe-foil yobhedu kuye kwenza ukuba ibe yinto ekhethiweyo kwezi tetheli zobutsha, ukuxhasa ukudityaniswa kwabantu abaphezulu kunye neendlela ezimfutshane zophawu, ngaloo ndlela ziphucula ukusebenza kwenkqubo.

2. Ukupakishwa kwe-chip-chip

3. Ukupakishwa kwesakhelo esikhokelayo

4. Inkqubo-kwi-pakheji (i-SIP)

5. Ukupakisha ngaphandle

6. Ulawulo lwe-Thermal kunye nokusetyenziswa kobushushu

7. Itekhnoloji yokupakisha i-Advanced (enje nge-2.5D kunye ne-3D ukupakisha)

Ngokubanzi, ukusetyenziswa kwendlu yobhedu kwiphakheji ye-chip akupheleli kunxibelelwano oluthe kratya kunye nolawulo lwe-thermal kodwa lwazisa kwitekhnoloji yokupakisha efana ne-chip, i-chip-in-pack, kunye nokupakishwa kwe-3D. Iipropathi ezininzi zokusebenza kunye nokusebenza ngokugqibeleleyo kwe-foil ye-foil play Dlala indima ephambili ekuphuculeni ukuthembeka, ukusebenza, kunye nokusebenza ngendleko zokupakishwa kwe-chip.